Used ASYMTEK C 341 #9225861 for sale

ASYMTEK C 341 photoresist equipment is an ideal solution for high precision repeatable dispensing and coating for a variety of products and processes, such as silver and chrome plating on wafer surfaces and sub-micron thin layers. It offers highly accurate, repeatable, and precise dispensing of photoresist with sub-micron resolution. C 341 system uses a unique dispense technique called "Cold Spray" to precisely apply photoresist onto a substrate. This method uses a cold-spray technique whereby the photoresist is dispensed at an extremely low temperature resulting in precise and precise control of the thickness of the photoresist coating. The cold-spray method also allows for precise control of any edge-deflection of the photoresist caused by the conditions of the substrate. ASYMTEK C 341 unit uses a unique air-nozzle to bring the resist to the substrate surface, eliminating contact between the substrate and the nozzle and thereby eliminating any potential physical damage to the substrate or any other product which may be exposed by the nozzle's contact. Moreover, C 341 machine features advanced timing and control capabilities such as delay time settings, velocity control and a variety of oscillation provides for accurate dispensing and coating of photoresist with minimal overspray. This ensures superior quality and uniformity in the photoresist coatings. Furthermore, the tool's self-diagnostic feature ensures repeatable and reliable performance, reducing the requirements of monitoring and maintenance. ASYMTEK C 341 asset provides an advanced level of process control and is used in a wide range of applications, including prototyping, printing, masking, assembly, and step-and-repeat assemblies. This flexibility allows for the widest range of components to be handled with the same high precision repeatability. Additionally, the model is user-friendly and can be integrated into existing processes with minimal setup time and effort. C 341 photoresist equipment is a cost effective, high-precision process for the application of photoresist onto substrates. With its wide range of applications and advanced control capabilities, it is ideal for both small-scale and large volume production.