Used BIDTEC SP 100 #9105133 for sale
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BIDTEC SP 100 is a state-of-the-art 'photoresist' equipment designed to facilitate the development and manufacturing of a wide range of electronic devices and components. Photoresist is a light sensitive material used in the process of etching on electronic components. BIDTEC SP 100system utilizes modern photoresist technology to provide superior results, making it a favorite among the professional engineering and electronics community. BIDTEC SP100 system is comprised of three core elements; a high speed digital imaging device, a specialized software control package, and advanced photoresist materials. Each component is designed and arranged in such a way as to optimize and streamline the photoresist etching process. SP 100's imaging device is capable of capturing and reproducing high resolution images and graphics from a wide variety of formats. Furthermore, the imaging speed can be adjusted so that the desired results can be achieved quickly and efficiently. The device is also able to process a multitude of different graphics types, making it useful for a wide range of manufacturing applications. SP100's software control package allows for easy manipulation of the photoresist etch process. It enables the user to alter and refine the imaging parameters to achieve the desired results with a greater degree of accuracy and precision. Furthermore, the control package allows for easy storage and reference of images and data for future use. BIDTEC SP 100's photoresist materials are specifically formulated for use with the unit and are carefully tuned to achieve ideal results. The materials are incredibly durable and highly sensitive to incoming light, allowing them to etch quickly and efficiently. BIDTEC SP100 machine is an excellent choice for those who require the highest levels of performance when etching electronic components. Its robust hardware and software design, coupled with its advanced photoresist materials, make it the perfect choice for high quality, precision etching.
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