Used CND PLUS CIE-2C3D02(04)-2 #9134146 for sale

CND PLUS CIE-2C3D02(04)-2 is a photoresist equipment used for precision photolithography processes which require high levels of precision and detail in the production of electronic components. It is an advanced, two-component photoresist system consisting of a photosensitive polymeric resin and a photoinitiator. The polymeric component, Cie-2C3D02(04), provides a very uniform and even thin film which is suitable to create very complex photolithographic patterns on a variety of surfaces including silicon, metals, and glasses. The photoinitiator, PLUS, generates free radicals upon irradiation and converts the resin into a highly insoluble substance which is stable at high temperatures. This provides a stable and robust photoresist unit with superior adhesion and unmatched resistance to chemicals and process-induced damages. CND PLUS CIE-2C3D02(04)-2 offers several advantages for nanofabrication processes including rapid binding and rapid dissolution in many aqueous solutions. The photoresist is also capable of producing very fine features with tight overlay control as well as wide area coverage. It is especially suitable for processes where space and environment control are paramount. Additionally, its high dielectric constant and low optical distortion make it suitable for applications such as MEMS, LED or solar panel fabrication. The resin is fully cured in as little as 250 ms and can be used on a wide range of substrates including metal, glass and even silicon. Its etching properties enable it to be used in processes where truly precise images must be created, such as stencil and contact lithographies. It offers excellent adhesion properties at both room temperature and at higher temperatures, depending on the application. Its excellent resolution enables it to produce intricate patterns and structures and can be used for the production of very small microelectronic components. CND PLUS CIE-2C3D02(04)-2 is a precision photoresist machine which can provide highly detailed, accurate structures for many microelectronic components. It offers high resolution, excellent adhesion and stable properties at higher temperatures. Its rapid curing time and versatility make it suitable for many applications where space and environment control are important.