Used CND PLUS CIE-3D02(04)-C #9223036 for sale

CND PLUS CIE-3D02(04)-C is a photoresist equipment consisting of two components, an acid novolak resin, and a photoactive compound. This system is a safe and convenient source of photoresist used in the fabrication process of printed circuit boards, along with other electronic components. The acid novolak resin is the base of CND PLUS CIE-3D02(04)-C, a crosslinked material providing structural support and adhesion. Its thermal, chemical and physical properties make it resistant to the conditions of the fabrication process. Most importantly, the acid novolak resin stabilizes the photoactive compound, which is its primary function in the photoresist unit. The photoactive compound, often referred to as the sensitizer, is the light-sensitive component of the photolithography process. It is responsible for change in chemical structure upon irradiation by visible ultraviolet (UV) light, making it soluble and removable upon development. When combined with the acid novolak resin, the photoactive compound influences the physical characteristics of the cured photoresist, making it flexible and durable. CND PLUS CIE-3D02(04)-C is designed to withstand the harsh environment of extremely high-quality chemically amplified photoresists, with minimal surface undulations. It is suitable for use in the advanced integration of low-voltage and low-power VLSI integrated circuits. Additionally, it provides uniform over-exposure latitude and cures to a cured film thickness of no less than 0.042µm with a maximum film thickness of 0.54µm. The photoresist machine has two types of coating methods, spin coating and pre-baked conformal coating. Spin coating is a technique wherein the pre-mixed photoactive compound and acid novolak resin are poured onto the substrate and rotated quickly to form a uniform coating network of photoresist. The pre-baked conformal coating method sees the pre-mixed photoresist poured over the substrate and dried in a furnace. In either method, a high-resolution image is then projected and transferred onto the photoresist, through a light source. After that, the photoresist undergoes a chemical treatment known as development, which removes the exposed areas of the photoresist, leaving an etch mask that is what's used for further fabrication. CND PLUS CIE-3D02(04)-C provides a reliable and quality source of photoresist with the necessary use of a light source and chemical treatment. With its versatile nature and ability to withstand the chemical and physical properties of advanced integration, this tool is suitable for modern day fabrication processes.