Used DELTA 7EK #9395519 for sale

DELTA 7EK is a photoresist system designed for use in the lithographic industry. Photoresists are UV or x-ray sensitive photographic materials used to create patterned microstructures on semiconductor wafers. 7EK is comprised of two components: a photosensitive layer (such as a photosensitive acrylic, epoxy, or polyimide) and a developer/substrate etchant. The photosensitive layer is deposited onto a substrate and then exposed to an energy source, such as UV or x-ray. The energy source causes a chemical reaction in the photosensitive layer that causes it to become more soluble in the developer/substrate etchant. This etchant can then be used to develop features on the substrate surface. These features are typically patterned by means of a photomask, but can also be developed directly by exposing the substrate to the energy source. In order to maximize its efficiency, DELTA 7EK photoresist system includes several features: 1. A multi-layer stack architecture that allows for more efficient patterning by allowing finer feature sizes to be obtained on a substrate. 2. An antireflective coating on the substrate to maximize the UV or x-ray energy absorption in the photoresist layer. 3. An optimized developer/substrate etchant composition for better resist pattern development. 4. A 'soft-bake' process that helps ensure uniform photoresist layer thickness and enhanced performance. 5. An 'anti-scumming' treatment to minimize the unwanted deposition of residual photoresist on the substrate surface. 7EK has been designed to provide superior patterning results, with excellent resolution, excellent surface planarity, and superior edge definition. Additionally, it is a highly reliable, cost-effective solution for the fabrication of sophisticated patterned structures. In conclusion, DELTA 7EK photoresist system is a reliable, cost-effective lithographic solution that provides superior patterning results, with excellent resolution, excellent surface planarity, and superior edge definition. It allows for finer feature size and enhanced performance through its multi-layer stack and antireflective coating, optimized developer/substrate etchant composition, and 'soft-bake' and 'anti-scumming' processes.