Used DNS / DAINIPPON 629 #9276178 for sale
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ID: 9276178
Wafer Size: 6"
Coater system, 6"
Loader / Unloader, 6"
Step motor driving system
Individual unit control
I/H Unit, 6"
Wafer handling arm material: SUS304
Wafer loading method: Handling arm with vacuum
Digital wafer sensor
Step motor driving system
Bake, 6"
Type: HP + CP
H.M.D.S Included
Wafer loading method: Wire moving with cylinder
Developer spin unit, 6"
Develop type: Rotation spray with spin motor
Chemical liquid discharge method: N2 Pressurization
Wafer chuck size, 70 mm
Spin cup
Polypropylene resin:
Upper: 8"
Lower
Nozzle type: Spray nozzle
Exhaust control system
Spin cover: Transparent acrylic
Maximum spin motor: 6000 RPM
Waste liquid drain: Natural drain
Wafer moving: Step motor
Coater spin unit, 6"
Coating method: Rotation with spin motor
Maximum RPM: 6,000
P/R Discharge method: BELLOWS Pump
Wafer chuck size, 70 mm
Spin cup
Polypropylene resin:
Upper: 8"
Lower
(2) Nozzles
Type: 1/8" / Track
Exhaust control system: Manometer
Spin cover: Transparent acrylic
Maximum spin motor: 6,000 RPM
Maximum P.R Dispense: 20 cc / 1 Strock
Waste liquid drain: Manual drain
Wafer moving: Step motor
Bake, 6"
Type: AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT 2-Stage
Maximum temperature: 250°C
Wafer moving: Cylinder
Utilities:
Power supply:
AC, 110 V, 30 A, 1 Phase
AC, 220 V, 30 A, 1 Phase
Air pressure: 4 ~ 5 Kg/Cm²
N2 Pressure: 3 ~ 4Kg/Cm
Vacuum pressure: 60~70 CmHg
Spin exhaust: 100 mm (20 mmHg)
Bake exhaust: 70 mm (20 mmHg).
DNS / DAINIPPON 629 is a photoresist equipment designed by DNS Screen Manufacturing Co., Ltd. of Japan. The system is used for the manufacture of semiconductor devices and other complex structures. It utilizes the properties of photoresist materials to produce sub-micron patterns in the fabrication process. The unit is comprised of a number of components, including a light source, lens unit, vacuum chamber, stepper motor, input/output board, control panel, and laser photocell. The light source used in the machine is a high-intensity laser that is used to measure and record the photoresist substrate's characteristics with high accuracy. It is characterized by a high resolution, low power consumption, and a wide dynamic range for measuring parameters. The light source is connected to a lens unit that is made up of high-precision optical components to focus the laser light at a specific point on the substrate. The laser photocell is a precision sensor used to detect the regions of exposure and measure the exposure time, this ensuring uniform exposure of the photoresist substrate to the laser. The photoresist substrate is placed in the vacuum chamber for precise leveling and positioning before exposure to the laser light. A stepper motor that is controlled by the input/output board is attached to the vacuum chamber to precisely move the substrate in the x-y axis. The control panel is then used to enter control parameters, such as exposure level, exposure time, and exposure area, to achieve desired results. Once the photoresist substrate is exposed, the imaging process begins. A chemical or physical etching process is then used to remove the exposed portions of the photoresist material to create the desired patterns. The quality of the patterns is then checked and verified using various imaging tools, such as scanning electron microscopes, atomic resolution microscopes, and scanning tunneling microscopes. The imaging process in DNS 629 tool facilitates the production of extremely fine features that are essential for the manufacture of semiconductor devices and complex structures.
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