Used DNS / DAINIPPON 80BW #293600854 for sale
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ID: 293600854
Wafer Size: 8"
Track system, 8"
Spin test
DEV
SOC-2
SOC-3
DI Test: Cut
PEB-DEV: PEB = 130/90
Rinse: DI Washing
DEV Coating: Coat-SOB-DEV
NTD: PEB-nBA
BARC Coating:
KARC-426
BARC Coat
PR Coating:
SOB-U12
PR Coat (100 s)
PR Coat (120 / 90 s)
PR Coat (KUPR-AW23) (U-12)
PR Coat (KUPR-AW23) (U-13)
PR Coat (U-12)
PR Coat (U-13)
PEB-NBA-U17
SM DI Washing
PEB - Develop:
Oven test
PEB = 120 / 60 - DEV
PEB = 130 / 60 - DEV
PEB = 130 DEV = 20 s
PEB = 130 DEV = 60 s
PEB = 120 DEV (17)
PEB = 115°C / 60 - DEV (U-17)
PEB = 130°C / 60 - DEV (U-08)
DEV Manual test
RF Test:
TMAH
PEB-DEV-RFP
PEB Test:
100 / 60
130 / 90
Stripping:
Ethyl lactate
Pantanol
Soaking:
Soak-PEB-DEV
SOB-Soak
KUPR-A52-Soak.
DNS / DAINIPPON 80BW is a high-resolution dry film photoresist equipment for the manufacture of printed circuit boards. This photoresist system is designed to offer superior performance, high reproducibility, and superior yields. It provides superior light shielding, a high sensitivity, and excellent resolution. This unit includes a film base developed by DNS, and a coating layer of self-developing photoresist, formulated by DAINIPPON. DNS 80BW photoresist machine employs an organic/inorganic, HEXAK™, double layer film as the base material. It provides excellent light barrier properties, which enable effective light transmission and attenuation, allowing the use of UV light with a wavelength range of 420-400 nm. This structure is adherent to most PCB surfaces and is resistant to solvents, moisture, temperature, and other harsh conditions. It also offers superior shelf-life stability and dimensional stability. The photoresist coating layer, which is formulated and manufactured by DNS / DAINIPPON, is optimized for high-resolution line widths and contact holes. It has a low viscosity and excellent wetting properties so it can easily be coated on the HEXAK™ film base. It also offers superior resolution and superior edge definition. The photoresist features a one-part active agent, which is mixed before use. This formulation ensures consistent performance, excellent edge definition, and high speed patterning. It is also thermally stable with thermal shock capabilities, which allows advanced processing and faster turnarounds. DAINIPPON 80BW photoresist tool is suitable for a variety of advanced applications, such as single or double-sided circuit boards, ultra-fine lines and contact holes, non-standard line widths, blind and buried vias, heavy copper structures, and micropatterns. Its superior light shielding and resolution capabilities enable high yields and reproducibility for high-performance printed circuit boards.
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