Used DNS / DAINIPPON RF3S #9392420 for sale

Manufacturer
DNS / DAINIPPON
Model
RF3S
ID: 9392420
Wafer Size: 12"
(5) Coater / (5) Developer system, 12" Does not include Hard Disk Drive (HDD).
DNS / DAINIPPON RF3S is a spin-on photoresist process that offers excellent resolution in the fine-pitch area with minimum aspect ratio loss. It utilizes a negative-tone resist, which is applied to the substrate using a process similar to spin coating. This equipment is perfect for surface mounting device (SMD) and fine-pitch device applications due to the high cycle life and high transparency resulting from using spin-on processing. The photoresist of DNS RF3S system is a phenyl-based acrylate copolymer material that is applied to the substrate using spin-on processing. This provides a uniform thickness and an excellent resolution. The coating contains photosensitive materials that are exposed to ultraviolet light to activate the exposure process. The resist is then developed, which defines the patterned features of the device. The unit also features a high-contrast developer that offers excellent image resolution and high process latitude. It is formulated for deep cavity patterns, and ensures good edge definition for narrow linewidths. It is also water resistant and can be used to cover large-area smaztmask liner and islands. DAINIPPON RF3S is also designed to be compatible with Pb-free processes. The resist has excellent adhesion to copper, meeting the requirements of both leadless and leaded board assembly processes. It is also low outgassing and has low water absorption for improved solderability. The machine offers excellent image resolution and a wide process window. It also features long shelf-life and superior thermal stability. In addition, the resist is a universal tool that is highly applicable with all type of photolithography plate systems. Overall, RF3S spin-on photoresist asset is an excellent solution for SMD and fine-pitch device applications. It provides excellent resolution and is highly compatible with leaded and leadless board assembly processes. The model can also be used with all types of photolithography plate systems and offers a wide process window and long shelf-life.
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