Used DNS / DAINIPPON SC-W60A-AV #9018261 for sale

DNS / DAINIPPON SC-W60A-AV is a state-of-the-art photoresist equipment used in semiconductor fabrication processes. It is capable of producing N-type or P-type patterns on substrates up to 200 mm in diameter and up to 30μm in thickness. The system is integrated with advanced design tools and simulation capabilities, making it an attractive solution for digital fabrication. The unit consists of a four-stage etching process which starts with the photoresist deposition. This is achieved by using two independent sources, substrate carrier table and dispenser. The substrate carrier table applies a uniform deposition of photoresist onto the substrate. The dispenser is adjusted to deposit a specific amount of photoresist and can be used to vary the thickness of the layer. Once the photoresist is applied, it is exposed to radiation through a mask. The radiation can be tailored to target specific parts of the substrate and to provide a custom pattern. During the imaging stage, two cameras are used to locate and gain insight into the features of the resist layer. An optical microscope and laser tool are available to facilitate imaging. The third stage of the process is the development stage. Here, the resist layer is developed and the imaged pattern is revealed. The exposed areas are further etched and the substrates are subjected to a rinse. This rinse removes any residual chemicals from the surface without destroying the patterned layer. In the fourth stage, a conformal layer is deposited to complete the pattern. Once the conformal layer is in place, the substrate is rinsed a second time to ensure all chemicals have been removed. After successful completion of these four steps, the wafer can be used for further processes such as doping or metallization. Overall, DNS SCW-60A-AV is an advanced photoresist machine offering a reliable and rapid process for creating semiconductor patterns on substrates. It is designed to provide excellent imaging resolution, high deposition accuracy, and a low possibility of defects. The tool can handle substrates up to 200 mm in diameter and up to 30μm in thickness, making it the perfect solution for advanced semiconductor manufacturing.