Used DNS / DAINIPPON SC-W629-BVQ #293748585 for sale

DNS / DAINIPPON SC-W629-BVQ is a two-part liquid photoresist system specifically designed for semiconductor lithography applications. The photoresist is a positive-tone chemical composite comprising an aqueous photosensitive layer and a non-photosensitive protective layer providing excellent resolution, high sensitive pattern transfer and reliable performance on a variety of substrates and process conditions during semiconductor device fabrication. The aqueous photosensitive layer consists of a donor polymer, initiator, binder and sensitizer. The donor polymer is a polyvinyl amine containing at least 4% hydroxyethyl methacrylate (HEMA) and initiator-binder which combines HEMA with a polyvinyl amino plasticizer. The sensitizer for the aqueous photosensitive layer is based on Co(NH3)6Cl3 and provides excellent pattern transfer across a broad spectral range. This sensitizer is especially effective for ultraviolet exposure with wavelengths of 365 nanometers (nm) and 248nm and is recommended for 0.30micron and smaller feature sizes. The non-photosensitive protective layer is a polymer-based secondary coating, which helps to protect the underlying photoresist layer. This layer provides an effective chemical barrier between the active photosensitive layer and the process environment during lithographic applications. It is resistant to most solvents and other chemicals used during processing and adheres to the underlying photosensitive layer without delamination. DNS SC-W629-BVQ photoresist system is designed for use in photolithography and is suitable for standard processing conditions from 25 to 40°C. This photoresist offers excellent resolution, pattern transfer, etching resistivity, compatibility with alkaline etchants, and high photospeed. This photoresist is solvent resistant, UV-stable and post-exposure bake stable, making it ideal for multiple process steps within semiconductor device fabrication. Overall, DAINIPPON SC-W629-BVQ photoresist system is an excellent choice for semiconductor device fabrication as it allows for the production of high-quality, high-resolution fine line patterns. It provides reliable performance, high resolution, and a wide range of process compatibility, making it a valuable tool in the formation of electronic components.