Used EBARA UFP 200 / 300M #84548 for sale

EBARA UFP 200 / 300M
Manufacturer
EBARA
Model
UFP 200 / 300M
ID: 84548
Wafer Size: 8" - 12"
Bump Plating machines, 8" and 12" Unit 1: 0 Low Temperature Plating M/C 4 Cup Cu / Zn Unit 2: 0 Bumping Plating M/C 4 Cup Cu Currently de-installed 2005 - 2006 vintage.
EBARA UFP 200 / 300M Photoresist Equipment is a state-of-the-art lithography system used to create intricate patterns and features on substrates. This unit is ideal for use in the production of high-tech integrated circuits, semiconductor devices, and other components used in the fabrication of microelectronic circuitry. It features a modular design to accommodate various production requirements. The machine is capable of producing feature sizes as small as 5 microns, using high quality lithographic masks. A high-precision linear encoder is used to ensure consistent alignment and overlay. It also includes an optional multi-layer capability to produce multiple layers of patterns with excellent consistency. The tool uses a specialty high-resolution imaging asset to accurately expose the selected photoresist to UV light. This exposure process produces a precise pattern of exposed and unexposed areas, which will later be transferred to the substrate. UFP 200 / 300M model also includes a drying module with precise temperature control and a spray-coating module for uniform coating. The developed photoresist is then transferred to the substrate through a direct contact process. This transferring process requires accurate registration between the mask and substrate. EBARA UFP 200 / 300M equipment features a precise X-Y stage to ensure precise alignment and overlay between the two. It also features an imaging system, capable of producing high-resolution images of the substrates and mask after contact. In addition, UFP 200 / 300M photoresist unit features a post-exposure etching process and a bake module. The post-exposure etching process is responsible for removing the photoresist that was not exposed to UV light. The bake module enables precise control over the temperature of the substrate and the photoresist, which is essential for proper etching. Finally, EBARA UFP 200 / 300M machine includes a cleaning process for removing any remaining photoresist from the substrate. This ensures accuracy and repeatability of the pattern transfer process and reduces potential for contamination. With its advanced features, UFP 200 / 300M Photoresist Tool is the ideal solution for a variety of microelectronics fabrication requirements.
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