Used EEJA / ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater #9280787 for sale
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ID: 9280787
Electro Chemical Deposition (ECD) system
Used for gold plating
Bench(Inner table): FM PVC material (Ivory)
Attached drawings:
Layout: K133-0001P-1
Process piping diagram: K133-0002M-1
Nitogen piping diagram: K133-0003M-1
Air piping diagram: K133-0004M-1
Vacuum piping diagram: K133-0005K-1
Plating cup:
Cup: HT-PVC material
Plating jigs:
Anode: Pt/Ti
Cathode: Ring type
Top plate: HT-PVC
Top ring: HT-PVC
Bridge disk: HT-PVC
Seal packing: Silicon
Top ring packing: Silicon
Diffuser: HT-PVC
Wafer press cup: Acrylic
Cylinder for pressure
Vacuum tweezers: Teflon(NC)
Reservoir tank:
Tank: HT-PVC
Capacity: 40 L
Level sensors: 2 points: low level ,empty level
Circulation pump: MD-100FY-3, 3 Phase, 200 V
Filter:10" length
Flow meter: 4-40L/min
Heater / Heater fuse: Teflon heater 2KW
Valve: Clean: HT-PVC
Piping: Clean: HT-PVC
Thermo sensor: Pt100 OHM
Di. Water rinse tank:
Tank: PVC
Capacity: 20L
Drain valve: Clean: PVC
Piping: Clean: PVC
Drag-out tank:
Tank: PVC
Capacity: 20L
Overflow: Not equipped
Drain valve: Clean: PVC
Piping: Clean: PVC
Process controller PLC:
Control range: plating control, interlock, alarm
Rectifier:
Capacity: 0-20 V, 4 A, constant current / constant voltage
Waveform: Direct Current
Touch panel:
Recipe choice
Recipe edit
Parameter set
Start
Manual pump operation
Alarm
Auto/Manual choice
Signal tower(3 color):
Plating: Green signal
Stand-by: Yellow signal
Alarm: Red signal
Others:
Hand shower: Front side
(2) Fluorescent light: 20W
Nitrogen gun : Front side
Vacuum tweezer- Front side
Nitrogen piping unit
Air piping unit
Vacuum piping unit.
EEJA / ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater is a photoresist system used for electroplating processes. It was developed by EEJA (ELECTROPLATING ENGINEERS OF JAPAN) to enable efficient, high quality, and cost-effective electroplating. EEJA Cup-Plater consists of two main components - the plater and the photoresist. The plater is a tool that is used to apply a thin layer of plating onto a substrate. It works by transferring a current through the substrate, which causes the electroplated metal to deposit on the surface of the substrate in the form of a thin coating. The photoresist is a specially-formulated liquid that is designed to adhere to the substrate and provide a barrier between it and the electroplating process. The plater then dispenses the photoresist onto the substrate and the photoresist forms a protective film. This film insulates the substrate from the current, and also prevents the electroplated metal from being distributed across the substrate. ELECTROPLATING ENGINEERS OF JAPAN CUP PLATER is designed to be used with a variety of substrates, including metal, plastic and glass. It is suitable for use in automated placement processes, as it has a low handling force and high level of accuracy. Additionally, it is designed to provide a high degree of uniformity in the distribution of plating, and it is well-suited for use in microfabrication. EEJA CUP PLATER is available in various sizes and capacities to suit the needs of different users. Cup-Plater is ideal for use in the production of highly-integrated electronics, such as integrated circuits, printed circuit boards and sensors. It also provides a low cost of ownership, due to its low cost of consumables and operating supplies. Additionally, its robust design and durability mean that it can withstand a variety of environmental conditions. This flexibility allows for its use in many different manufacturing settings. Overall, EEJA / ELECTROPLATING ENGINEERS OF JAPAN CUP PLATER provides a reliable and cost-effective solution for processes requiring electroplating. It is easy to use, requires little operator skill and can be used to produce high-quality products in an automated manner. The robust design and high level of accuracy make it a flexible and reliable choice for a wide variety of electroplating applications.
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