Used EEJA / ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater #9280818 for sale
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ID: 9280818
Electro Chemical Deposition (ECD) system
Used for Cu & Ni plating
Bench(Inner table): FM PVC material (Ivory)
Attached drawings:
Layout: K133-0001P-1
Process piping diagram: K133-0002M-1
Nitogen piping diagram: K133-0003M-1
Air piping diagram: K133-0004M-1
Vacuum piping diagram: K133-0005K-1
Plating cup:
Cup: HT-PVC material
Plating jigs:
Anode: Pt/Ti
Cathode: Ring type
Top plate: HT-PVC
Top ring: HT-PVC
Bridge disk: HT-PVC
Seal packing: Silicon
Top ring packing: Silicon
Diffuser: HT-PVC
Wafer press cup: Acrylic
Cylinder for pressure
Vacuum tweezers: Teflon(NC)
Reservoir tank:
Tank: HT-PVC
Capacity: 40 L
Level sensors: 2 points: low level ,empty level
Circulation pump: MD-100FY-3, 3 Phase, 200 V
Filter:10" length
Flow meter: 4-40L/min
Heater / Heater fuse: Teflon heater 2KW
Valve: Clean: HT-PVC
Piping: Clean: HT-PVC
Thermo sensor: Pt100 OHM
Di. Water rinse tank:
Tank: PVC
Capacity: 20L
Drain valve: Clean: PVC
Piping: Clean: PVC
Drag-out tank:
Tank: PVC
Capacity: 20L
Overflow: Not equipped
Drain valve: Clean: PVC
Piping: Clean: PVC
Process controller PLC:
Control range: plating control, interlock, alarm
Rectifier:
Capacity: 0-20 V, 4 A, constant current / constant voltage
Waveform: Direct Current
Touch panel:
Recipe choice
Recipe edit
Parameter set
Start
Manual pump operation
Alarm
Auto/Manual choice
Signal tower(3 color):
Plating: Green signal
Stand-by: Yellow signal
Alarm: Red signal
Others:
Hand shower: Front side
(2) Fluorescent light: 20W
Nitrogen gun : Front side
Vacuum tweezer- Front side
Nitrogen piping unit
Air piping unit
Vacuum piping unit.
EEJA / ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater is a photoresist coating system designed for moderately large substrates and shows excellent adhesion and thin coating thickness. EEJA Cup-Plater uses photolithography, a type of lithographic process that transfers a pattern onto a substrate. This pattern transfer is done by a light source or radiation, which can take the form of an UV lamp, X-ray, e-beam, laser beam, etc. The substrate is then coated with a photoresist, which is a type of polymer that is sensitive to light and radiation energy, forming a thin film. Using ELECTROPLATING ENGINEERS OF JAPAN CUP PLATER, the photoresist is applied in a thin, uniform layer on the substrate. This is due to the unique design of the plating structure which uses a cup-shaped plating bath, allowing for coating to be achieved in a specific area. CUP PLATER also uses an electroplating process to apply the photoresist, utilizing a controlled electric potential between the substrate and the material of the bath. As the electrical potential passes through the bath, it causes dissolved metal atoms in the solution to be attracted to the substrate, resulting in a uniform, ultra-thin coating of photoresist. In addition to the electroplating process, EEJA CUP PLATER also utilizes a drying process. This drying process uses a hot gas, such as nitrogen or air, to evaporate the liquid within the photoresist resulting in quick drying times and uniform coating thicknesses. ELECTROPLATING ENGINEERS OF JAPAN Cup-Plater's drying ability also helps it deliver adhesion and uniformity that is superior to that of conventional spin coaters or vacuum deposition process. Overall, Cup-Plater is a useful and efficient system for coating photoresist onto large substrates in a uniform and efficient manner. It's capabilities of quickly and uniformly drying the photoresist make it a great choice for coating applications where a uniform coating thickness and strong adhesion are required. In addition, its precise electroplating process and cup-shaped plating bath help to achieve precisely thin coatings along with excellent adhesion properties.
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