Used FSI / TEL / TOKYO ELECTRON Mercury MP #9161972 for sale
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ID: 9161972
Vintage: 1996
Spray processor, 8"
Software: 11
FSI Standard exhaust config: Yes
Dual exhaust: No
Turntable style (PFA vs. Ti vs. SS): PFA 918600-003
Motor and motor speed controller: Upgrade 232608-003
Booster pump: Yes, not dual
Helios: Yes
Ti T/C's: No
Canister remote length: 25'
Vertical lift kit length: 20'
Vertical lift kit: Some canisters
Center SP etch probe: No
SBSP: Yes
SBSP Etch probe: Yes
I/R Htr(P)ost Man / (C)hem spec: No
I/R Heater split manifold: No
I/R Heater bypass valves: No
CPU 286: No
CPU 486 25 mH: No
CPU 486 80 mH: No
CPU 586 Yes: 922081-001
HF Last: Yes
LPP w / Flowmeter: Yes
HF Last rinse bypass: Yes
DI MIX: Yes
H2SO4(Analog vs. NT): Yes
H2O2 (Analog vs. NT): NT 30-300, 915191-102
HF400: Yes
HF402 (Analog vs. NT): NT 15-150, 915191-101
HCL (Analog vs. NT): NT 15-150, 915191-101
NH4OH (Analog vs. NT): NT 15-150, 915191-101
Can position 1: Sulphuric (H2SO4)
Can position 2: Hydrofluoric (10:1)
Can position 3: Hydrofluoric (10:1)
Can position 4: Ammonium hydroxide (NH4OH)
Can position 5: Hydrochloric (HCl)
Can position 6: Hydrogen peroxide (H2O2)
HF / DI On-line blending: Yes
Manifold type: PFA
DI Flow switch / monitor: No
N2 Flow monitor: No
Recirculation: No
Chemical heater (Stand alone): No
N2 Heater: No
UPS: No
Component rinse: No
SECS Comm: Yes
Rear access: Yes
Chemical sampling: No
Photohelic monitor: Yes
MHS: No
Dual canister rotary board: No
Autofill: HF- SULFURIC
Remote touchscreen: No
Dual touchscreen: No
Direct feed: No
Process application #1: RCA Clean
Process application #2: B Clean
Process application #3: SPM Only
Process application #4: HF Last
Pressure / Flow settings
Bowl exhaust - IWC: 0.8 +/- 0.2
Bowl exhaust - FPM: N/A
1996 vintage.
FSI MERCURY MP is a photoresist equipment developed by FSI International, Inc. It is used in semiconductor etching processes, where semiconductor wafers are exposed to UV light, which changes the properties of the exposed material, making it easier to etch away. MERCURY MP system uses a vacuum photoresist unit, which allows for precise etching of the substrate. The machine is designed to provide a high-performance and reliable environment for fine-line etching of semiconductor wafers. The vacuum photoresist tool uses a light projection asset and an irradiation chamber for uniform exposure to UV light. In the irradiation chamber, high-energy UV light is projected onto the wafer to expose the photoresist material to the light. The exposure controls the etch depth and eliminates the chance of undercutting or over-etching of the material. The model has a variety of features which help to ensure precise control and accuracy. The equipment uses precise imaging optics and a robust, high-speed infrared laser to direct light onto the wafer, allowing for very fine-line resolutions. The system also utilizes precise masking and imaging systems, combined with a highly efficient high-performance optical projection unit (OPSM) for an even exposure. The laser is also able to quickly adjust its output radiation, allowing for precise control of the exposure time. FSI MERCURY MP machine is suitable for a wide range of photoresist processes, such as deep etching and ultra-fine patterning. It also has an advanced, programmable user interface, which allows users to quickly and easily set parameters and view the etching process in real-time. MERCURY MP tool is a powerful and precise photoresist asset, suitable for precision etching in the semiconductor industry. It is ideal for the production of high-density integrated circuits, as well as other microelectronic devices. The model offers a reliable and high-performance environment, with precise imaging optics and a robust, high-speed laser, as well as programmable user interfaces, allowing for quick and easy parameter setting.
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