Used FSI / TEL / TOKYO ELECTRON Mercury OC #190491 for sale

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ID: 190491
Wafer Size: 8"
Semi-Auto Batch Spray System, 8" Specifications: Maxiumum wafer size: 200mm (25 wafer carrier) Maximum motor speed: 1000 RPM Canister volume: 14.5 liters Mercury Process Console Mercury Turntable Mercury Touchscreen Chemistry setup: a) Ammonium Hydroxide b) Hydrogen Peroxide c) Sulfuric Acid d) Hydrofluoric Acid (HF) Operations and Maintenance Manuals (full set) Power: 115VAC, 15 Amps, 1PH, 60Hz.
FSI Mercury OC is a photoresist system used in the semiconductor industry to deposit thin films on silicon wafers and to fabricate intricate structures from silicon and other materials. The system uses a mercury-based light source (OC) to expose the photoresist layer in the process of lithography to produce the desired patterns and structures, and is designed with advanced optics and software for precise control and accurate results. The process of photolithography entails spinning a wafer coated with a photoresist material on a spindle and exposing the resist layer to a light source in defined pattern shapes. The feature of Mercury OC is the precise control of the light source, achieved by its unique optics and software. This enables the formation of feature sizes down to less than one micron, at unprecedented levels of accuracy and stability. Another key feature of FSI Mercury OC is its high-resolution imaging, achieved by utilizing a low light intensity coupled with a high aperture field of view. This enables the imaging of many different levels of pattern geometry and structure, including features that are as small as 0.2 microns. Additionally, its optics are designed to minimize pattern distortion in the form of line placement errors, pattern shifts, and overlaps. Mercury OC is a stand-alone lithography system, and the user can adjust the parameters as needed. This includes exposure time, laser power, focus position, and beam tilt, which can be modified for the patterning of any geometry. FSI Mercury OC is an optimal choice for patterning silicon and other materials with high accuracy and reliability. It provides a high degree of control, allowing users to accurately achieve the desired features. Its high resolution imaging, low light intensity, and nanopatterning capabilities enable users to produce intricate patterns and structures, resulting in cutting edge high-end semiconductor technology.
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