Used HIRANO TECSEED TM-MC #293608799 for sale

HIRANO TECSEED TM-MC is a photoresist equipment specifically designed for use in precision electronic device packaging. This system uses an optical mask to coat the surface of a semiconductor wafer with a photoresist. The photoresist unit is polymer based and composed of formaldehyde, developer, substrate, and a photoresist material. The photoresist machine is designed to free process design from conventional lithography. TM-MC tool is capable of forming and etching intricate patterns on the semiconductor wafer with a high level of precision, accuracy and detail. Photoresist patterns are uniformly created on a silicon wafer with a HIRANO TECSEED TM-MC's optical mask. The mask is composed of transparent and opaque regions and a particular cross section may be chosen to create the desired pattern on the semiconductor wafer. TM-MC photoresist asset then applies the photoresist material to the semiconductor wafer. The substrate is immersed into a solution of the photoresist material for a set amount of time. During this time, the photoresist adheres to the wafer's surface and the opaque portions of the mask block the photoresist from coating the transparent regions. Once the immersion has completed, the wafer is then baked so as to harden the photoresist. This baking step also catalyzes the photoresist material and allows it to adhere firmly to the surface of the substrate. The next step of the photoresist model is for the developer to remove the photoresist material in the transparent regions. The developer is a chemical solution that dissolves the photoresist material leaving behind the hardened photoresist material in the opaque regions and the expanse of the substrate in the transparent regions. This process creates the desired pattern on the wafer. Lastly, the etchant is used to create the features and conductive pathways on the wafer. The etchant solution is composed of water, ammonium chloride and sulfuric acid. The etching process involves a series of chemical reactions that dissolve the unhardened photoresist and underlying layers of material. This process also creates channels and pathways on the wafer to relocate, intersect and stop the flow of electricity. HIRANO TECSEED TM-MC photoresist equipment is capable of producing high-precision patterns and features on the surface of a semiconductor wafer with exacting accuracy and detail. This is an invaluable asset for the development and manufacture of precision electronic device packaging.