Used HONGSU BOE #9328982 for sale
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ID: 9328982
Wafer Size: 5"
Photoresist removal system, 5"
DI Water
N2
CDA
H2SO4
H2O2
Acid exhaust
Power supply: Single phase, 220 V, 3-wire, 210 A, 46.2 kVA.
HONGSU BOE is a photoresist equipment that creates a thin polymer film coating on surfaces. This photoresist system uses a light-sensitive mixture of a photoinitiator and a polymeric binder. The polymeric binder's purpose is to give the photoresist its physical properties. The photoinitiator's purpose is to facilitate the radical polymerization of the binder when exposed to ultraviolet light. The photoresist unit is used for creating patterns, etching electronic components, and forming metallizations onto substrates. BOE offers a variety of photoresists with various properties such as solubility, viscosity, and the ability to resist specific chemical etching materials. This photoresist is a dry film alternative to liquid photoresist systems. When applying the photoresist on a substrate, HONGSU BOE film is applied in a thin film. The film can be applied using spin coating, casting, dipping, or spraying. Once the photoresist coating is in place, the substrate is exposed to ultraviolet radiation using a photolithography printer. The light molecules break apart at the ultraviolet exposure and cause radicals to form on the photoresist. This initiates a series of reactions that cause the photoresist to polymerize into a coherent mass that adheres to the substrate. The exposed area hardens and forms a relief pattern when developed. After development, the photosensitive material is removed and the relief pattern left on the substrate behind. The relief pattern is the desired pattern and it serves as an etch mask. The etch mask describes the area to be etched out from the substrate, such as the significant patterns of electronic components. After the etching process, the residue of the photoresist is removed to expose the organic or inorganic material of the substrate. In conclusion, BOE is a photoresist machine that is used to create patterns on substrates. This tool requires the application of a thin film photoresist on the substrate, exposure to ultraviolet radiation, and development of the photoresist relief pattern. This photoresist asset is highly popular in the fields of electronics, metallization, and patterning due to its efficient and effective results.
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