Used M-TECH 4300S #293664059 for sale

M-TECH 4300S is a high-end photoresist equipment particularly suited for wafer size substrates. The system offers a number of features which enable it to meet the demanding needs of modern wafer fabrication processes. The unit consists of a resist application module, a planarization module, an exposure module, a post exposure module, a developing module and a spin-off module. All these modules are integrated to form a complete machine. The resist application module of 4300S is used to apply photoresist to wafer size substrates. The resist is dispensed onto the substrate and evenly distributed with a powerful spinning motor. This ensures a uniform coverage of the resist on the surface. The controlled flow of resist between the substrate and the dispensing nozzle is maintained by a high precision nozzle-cavity separation. The planarization module contains a precision controlled planarization surface. This surface is used to precisely and accurately smooth out uneven surfaces of the substrate created by the resist application module. The smooth surface is essential for contact lithography and defining features in the photolithography process. The exposure module of the tool utilizes advanced optics to ensure a precise and uniform exposure. The optics provide an excellent uniformity and high contrast ratio when transferring the image onto the substrate. The optics are fitted with autofocus and image recognition capabilities to ensure accurate exposure at high precision. The post exposure module of the asset ensures a uniform, accurate, and complete etching of the etched substrate. This is achieved through the utilization of the advanced post exposure correction algorithms, which precisely control the mask alignment, exposure dose, and etching. The developing module is used to remove the exposed photoresist from the substrate. This is carried out in an automated fashion with a high degree of precision using advanced image recognition algorithms. The spin-off module is used to rinse off the remaining photoresist from the substrate. This is accomplished by spinning the wafer at a high speed and ensuring a maximum utilization of the rinse chemistry and a complete rinse off of the photoresist. Overall, M-TECH 4300S is an advanced photoresist model which enables users to accurately and reliably perform photolithography processes on wafer size substrates. The equipment features a number of modules which ensure uniform resist application, precise and accurate exposure, uniform etching, and complete rinse off of the photoresist. This makes 4300S an ideal choice for modern wafer fabrication processes.