Used NORDSON / ASYMTEK C 720 #9258637 for sale

NORDSON / ASYMTEK C 720
Manufacturer
NORDSON / ASYMTEK
Model
C 720
ID: 9258637
Dispensing system.
NORDSON / ASYMTEK C 720 is a photoresist equipment made for automated dispensing of thin-film coatings at micro levels. This system utilizes advanced digital process control technology to precisely and accurately dispense exact amounts of resist layers used in all types of chip packaging and assembly Lities. It has three components: controller, dispenser, and gantry. The controller is a robust computer designed to integrate the three components for quickly and accurately metering material. It is equipped with multiple servo motors, which allow for accurate dispensing and precise movement of the dispenser. The dispenser is an automated unit that is used to precisely deposit the photoresist layer onto a PCB or IC. NORDSON C 720 is designed for use with NORDSON Systems dispensing solutions, such as micro-drop dispensing valves, centrifugal pumps, and syringe pumps. These systems can be used to dispense a wide range of fluids, including adhesives, inks, coatings, gels, pastes, and solvents. Lastly, the gantry is the component that moves the dispensing robot across the PCB or IC. It is equipped with high-precision motion control technology and four axes of motion - X, Y, Z, and R. This allows the robot to precisely dispense material with uniformity and accuracy. ASYMTEK C 720 also has several benefits that make it one of the best photoresist systems on the market. It features easy setup with a intuitive user interface and is designed for quick and accurate dispensing. Moreover, the machine's use of adaptive non-contact dispensing technology ensures that no contact is made with the substrate, resulting in minimal waste or sloshing. The tool can also be configured to automatically switch material containers to ensure uninterrupted production. Overall, C 720 is a reliable photoresist asset that provides cost-effective and productive micro-dispensing solutions. Its simple setup and maintenance make it an attractive choice for all kinds of chip packaging and assembly applications.
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