Used NTACT nRad #293821989 for sale
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ID: 293821989
Die coating system
Aluminum die
(3) Aluminum chucks
Granite chuck
(2) Recessed wafer chucks
Heated chuck
(2) Stainless steel extrusion dies
Heated die
(2) POH diaphragm pump and valves
(2) Recessed PV-wafer chucks
Die manifold
Syringe pump
Lead-in plate
Die priming trough with inserts
Touchscreen interface (HMI)
Wetted component kit
Heated reservoir and stirrer
Base table
Clean enclosure
Inert enclosure
Power requirements: 120/240 VAC, single phase, 50/60 Hz, 10 A.
NTACT nRad is a advanced photoresist equipment that is designed to meet the rigorous demands of modern semiconductor manufacturing processes. This system offers a comprehensive suite of features and capabilities that enable high precision patterning and critical dimension control in the fabrication of integrated circuits and other microelectronic devices. At the core of nRad unit is its advanced photoresist formulation, which is optimized for high sensitivity, resolution, and etch selectivity. The photoresist material is designed to be highly sensitive to light exposure, allowing for precise pattern transfer onto the substrate material. Additionally, the machine incorporates a unique blend of chemical components that enhance the adhesion and durability of the photoresist layer, ensuring long-term performance and reliability. One of the key features of NTACT nRad tool is its advanced exposure technology, which enables precise control over the exposure dose and energy distribution. This allows for fine tuning of the patterning process to achieve the desired feature sizes and shapes with high fidelity and repeatability. The asset is equipped with a high-intensity UV light source that delivers uniform illumination across the entire substrate surface, ensuring consistent and reliable patterning results. NRad model also incorporates state-of-the-art patterning tools and techniques that enable complex patterning schemes and multi-layer integration. The equipment is capable of supporting multiple patterning methods, including double patterning and spacer patterning, which allow for the creation of dense and highly integrated device structures. Additionally, the system features advanced pattern transfer capabilities, such as etch bias control and sidewall profile control, which enable precise definition of critical device features. In addition to its advanced patterning capabilities, NTACT nRad unit offers a range of processing options to support various substrate materials and device designs. The machine is compatible with a wide range of substrates, including silicon, gallium arsenide, and sapphire, and can accommodate both front-end and back-end processing requirements. The tool is also capable of supporting advanced packaging technologies, such as through-silicon vias and wafer-level packaging, enabling seamless integration into advanced device manufacturing processes. Overall, nRad asset is a versatile and reliable photoresist solution that is ideally suited for the demanding requirements of modern semiconductor manufacturing. Its advanced features and capabilities enable high precision patterning, critical dimension control, and multi-layer integration, making it an ideal choice for the fabrication of next-generation microelectronic devices. With its advanced exposure technology, state-of-the-art patterning tools, and broad substrate compatibility, NTACT nRad model offers a comprehensive solution for achieving high-performance device structures with unmatched precision and reliability.
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