Used SEC BEP-2708 #9398877 for sale

SEC BEP-2708 is a photoresist equipment developed by Samsung Electronics Co, Ltd. It is a high-performance, low-cost photoimageable material used for microlithography applications. The system is composed of several components, all of which are essential for successful production of intricate microelectronics devices, particularly those with ultra-fine features. The key components of BEP-2708 include: photoresist thin film, the substrate, the exposure tool, and the development and hardening unit. The photoresist thin film is a polymer material that is light sensitive. It is applied to the substrate by spin coating. The film evaporates rapidly, leaving the desired image. When light hits the film, projecting a pattern onto the substrate, the image is accurately retained. SEC BEP-2708 provides an improved pattern thickness as compared to compared to its conventional counterparts, thus providing better etching & surface planarity performance. The substrate is a material onto which the photoresist thin film is applied. It can be either of the two materials: SILK or Nitride. SILK is a silicate matrix composed of chemically etched layers that provide CMP uniformity and variable surface protection. Nitride is a silicon oxide base layer which is then covered with a silicon nitride film. This substrate provides better etching features and improved planarity. The exposure tool is used in the photoresist machine as it is essential for precise imagines. It uses intense light beams to cast images onto the photoresist. Typically, BEP-2708 are exposed with deep UV, X-ray, or E-beam tools. The tool also utilizes its advanced in-die enhancement technology to provide better image sharpness and higher resolution for its products. After the photoresist asset is exposed, the development and hardening model take over. This consists of both wet and dry development parts. Wet development involves the use of chemical solutions to remove unexposed photoresist. For dry development, oxygen plasma or ozone-based systems are used to cure hardened images. The hardened photoresist is then covered with another protective layer, typically a SiN substrate film, which helps to improve etching performance and surface planarity. SEC BEP-2708 provides a high-performance and low-cost solution for microlithography applications that require precision images. With its advanced components and their finely integrated processes, the equipment produces intricate patterns with a thickness and uniformity that surpass that provided by alternative photoresist systems. As such, it is an ideal photoresist system for those seeking to produce high-quality, high-precision microelectronics devices.