Used SEMITOOL 8300S #9275 for sale

SEMITOOL 8300S is a photoresist processing system primarily designed for etching and developing of wafers up to 8 inches in diameter. It offers precise control and repeatable results, making it suitable for a range of semiconductor applications including MEMS, nanotechnology and optoelectronics. It is comprised of a wet bench station that accommodates two chemical tanks — which can be pre-programmed with multiple processes — and a processing chamber. The system is equipped with a wide array of accessories, such as an acid neutralizer, pressure controller, vacuum vent, heat exchanger and digital thermostat for tailored processing. The chamber features a photoresist plate, which uniformly distributes ultraviolet radiation (UV) on the wafer surface. It is further divided into two zones that can be independently controlled - one for incision activation and one for development. The UV intensity and processing time can be adjusted to accommodate for wafer properties such as thickness and resistivity. The photoresist plate can be quickly and easily removed to switch between large and small wafer diameters. In the first zone, optically active masks are placed over the wafer and activated by the UV light. This causes an oxidation process which etches and forms desired shapes on the surface. The second zone utilizes wet chemical solutions to remove excess photoresist and clean the surface. This is accomplished by using a combination of a vacuum, higher- pressure gear pump and low-flow injector. The system also opens up possibilities for more complex etching processes using reactive ion etching (RIE) and deep reactive ion etching (DRIE). RIE can be used to etch in three dimensions, while DRIE is effective at removing thick layers of photoresist and providing razor-sharp features. Furthermore, wet etching processes can even achieve results through bonded oxide etching techniques. Overall, SEMITOOL 8300 S provides a comprehensive yet user-friendly solution for designing and fabricating wafers for high-precision applications. Its flexibility in terms of plate insertion, pump configurations and process parameters ensures it remains up-to-date with the latest expectations and technology.