Used SEMITOOL ECP LT210 CU #9093697 for sale

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Manufacturer
SEMITOOL
Model
ECP LT210 CU
ID: 9093697
Wafer Size: 8"
Vintage: 1999
CMP - Cu plating system, 8" (10) Chambers Module: CMP/CU SMIF interface: (2) Asyst indexers Process application: copper plating Copper process: yes Batch/single wafer: single wafer Electrochemical copper deposition in diluted CuSO4/H2SO4 solution with organic additives Backside cleaning and bevel etching with diluted PIR-Solution (6) Plating chambers (4) Bevel etch capsules External chemical Conc. Control by support tool Capable of Pulse-Reverse-Plating and DC-Plating and Hot-Entry ECD Chamber Retrofit: Wet contact rings and finger clean for ext. ring lifetime Photometric insitu analysis: Cu and H2SO4 Robot Beam Capsule Retrofit: fingerless rotors Capsule Retrofit: one piece delivery manifold Modified bowl return-flow for bubble suppression M&W Systems chiller Dynatronix Power Supply Upgrade Capsules: adjustable flowmeters for chemical supply UPS-Retrofit: Data Saving in case of power loss) Plating rotors with extended wafer supporting posts Currently crated CE marked 1999 vintage.
SEMITOOL ECP LT210 CU is a photoresist equipment that is used in the semiconductor industry to produce precision surfaces and patterns with high accuracy and repeatability. It consists of a dual beam chamber with up to four stepper stages, which are able to provide highly accurate images on the substrate. This system is capable of providing a variety of lithography techniques such as photomask, projection mask, and thin film. It also features a control pad for controlling parameters such as exposure time, stage shift, and magnification among others. The unit utilizes a combination of direct light source, projection optics, and detector to accurately align the substrate, performing lithography with accuracy at all levels. The stepper stage can be programmed for a variety of substrate sizes and shapes, allowing for a high degree of uniformity in the patterns created. Additionally, the machine features a spin-coater for evenly coating the photoresist layer, improving pattern accuracy. The tool can process multiple layers of photoresist and achieve resolutions of up to 10nm and has an adjustable rotation speed of up to 5000 rpm. The asset is compatible with a number of substrate materials, including silicon, glass, and metal among others. It also features a highly sensitive digital CCD detector for efficiently checking the pattern development. Additional features of the model include optional environmental control chambers, a cesium flood lamp for enhancing the image contrast, and a number of safety and security features such as an electrostatic field voltage monitor, as well as a light-clamp mechanism. ECP LT210 CU is an efficient and reliable lithography equipment for producing high precision surface patterns and designs. With its versatile feature set and performance capabilities, it carries the perfect balance between accuracy, cost effectiveness, and speed, making it an ideal solution for a wide range of industrial applications.
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