Used SEMITOOL Scepter SAT 211 (25 04) 0 #9379202 for sale

SEMITOOL Scepter SAT 211 (25 04) 0
ID: 9379202
Gap etch / SAT System.
SEMITOOL Scepter SAT 211 (25 04) 0 is a high-precision semi-automated photoresist equipment designed for advanced semiconductor fabrication. This integrated system combines the Scepter SAT 211 photoresist dispenser, E-Beam track unit, wafer scrubber and trace analyzer in one unit. The Scepter SAT 211 photoresist dispenser features a high-resolution gravimetric auto-dispensing machine, capable of accurately and consistently dosing photoresist, reducing chemistries for better control. The integrated E-Beam track tool provides precise wafer positioning at a speed of up to 300 wafers per hour. The wafer scrubber is designed to precisely control both wet and dry cleaning processes, dispensing chemicals, rinsing and scrubbing. Finally, the trace analyzer asset uses electro-optic components to detect particles that have been introduced to the wafer's surface during the wafer scrubbing process. The combination of the Scepter SAT 211's components enables increased throughput, improved process consistency and reliability, and superior control of wafer cleaning processes. The photoresist dispenser allows for an even and reliable application of resist to the wafer surface, while the advanced E-Beam tracking model ensures accurate alignment in the steps of the process. The trace analyzer equipment enables the detection of particle contaminants, coarse or fine, in order to achieve finer control of the cleaning process. In combination with the automated wafer scrubber, these components provide an integrated and precise wafer cleaning process. The integrated system design makes the Scepter SAT 211 an efficient and reliable solution for evaporative technologies, chemical etching and deposition processes. With features such as high-precision uniform spraying, reduced chemistries for improved control and particle detection, this unit supports greater accuracy and reliability in semiconductor fabrication. The advanced process control capabilities also allows for more precise plating and substrate cleaning. Furthermore, the machine's automated wet and dry cleaning functions significantly reduce labor costs, improving the overall efficiency of the process.
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