Used SEMITOOL STI 870D #9307758 for sale
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ID: 9307758
Rinser / Dryer
Handle substrates diameter: 3"-6"
Dual stack
Wafer cassettes, 6"
(2) Rotors: H BAR IN, 2800 RPM MAX, BAL 0-25, A194 60MB
Operation / Maintenance manual.
SEMITOOL STI 870D is a photoresist equipment designed to enable microelectronic packaging, thinning and wafer-level MEMS/NEMS. It provides an integrated, high-quality, cost-effective platform for substrate materials handling, photolithographic processing and micro-fabrication. The system is composed of several components, including a wet station, pre-clean chamber, pre-bake chamber, micro-fabrication chamber, and metrology unit. The wet station is used to apply thin-film and liquid photoresist to the surfaces of the substrates, allowing for precise substrate alignment and deposition. The pre-clean chamber uses a combination of chemicals and mechanical abrasion to remove any surface contaminants from the substrate. The pre-bake chamber then uses a chemical vapor deposition technique to evaporate any remaining organic material on the substrates. The micro-fabrication chamber then uses a high-powered laser to pattern the photoresist into millions of individual circuit features. Finally, the metrology machine measures the accuracy and resolution of the circuit features. The tool is designed to be semiconductor-industry compliant and is capable of reproducing complex shapes, dramatic feature size variance and intense geometrical accuracy. STI 870D exceedsempacting efficiency, time-to-market and cost control of eelectronics micro-fabrication processes. It has a comprehensive suite of asset monitoring and process control software, providing engineers with the real-time data to make educated decisions. The model is low-maintenance, low-cost and can easily be modified to process different substrates and feature sizes. The equipment is also extremely precise and repeatable, making it ideal for high-volume production. Overall, SEMITOOL STI 870D is an advanced photoresist system designed to enable efficient and cost-effective microelectronics packaging and fabrication. It provides an integrated platform for substrates materials handling, photolithographic processing and micro-fabrication, offering engineers high-resolution patterning and geometrical accuracy.
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