Used SEMIX / TOK TD6133UD #293657151 for sale

SEMIX / TOK TD6133UD photoresist equipment is designed for the development of advanced photomask applications. The system uses a resist etching pattern designed using a quartz optical etching unit, allowing for a high degree of accuracy and resolution. The machine uses a reactive ion etching process to create the etch pattern, ensuring high performance and dependability. The tool is well-suited for use in a variety of photomask production areas. The asset features a quartz optical etching model with a 350-watt high energy lamp, allowing for accurate etching of top-level circuits. The equipment is designed with high power laser reticle writing, allowing for small geometries and photomask patterns to be produced with maximum precision and small laser spots. The system also has a high resolution image processor, which allows for the optimization of reticles and photomasks for the target photoresist adhesion. TOK TD6133UD photoresist unit has a MAX-8 MICRO processor that is optimized for rapid etching and imaging, as well as measurement and characterization of photomasks. The machine also allows for the utilization of photoresists with different molecular weight or composition for enhanced quality and properties of the photomasks. The tool is designed with a high repeatability of etching and imaging, ensuring a consistent level of production and quality. The maximum resolution achieved by SEMIX TD6133UD asset is 28 nm. It operates under a vacuum state of 10-4 Torr with a maximum deposition or etching rate of 10 nm/s. The model is PCR and OMI compatible, and has conformal deposition of resist materials with a minimum deposition thickness of 0.2 nm. The equipment also has laser ablation capability with a high accuracy of sub-micron level formation. In summary, TD6133UD photoresist system is designed for the development of advanced photomask applications. The unit uses a quartz optical etching machine and a reactive ion etching process for etching patterns. It features a MAX-8 MICRO processor, with a maximum resolution of 28 nm, and a maximum deposition or etching rate of 10 nm/s. The tool also has a high resolution image processor, which allows for the optimization of reticles and photomasks. Additionally, the asset has laser ablation capability with a high accuracy and PCR and OMI compatibility.