Used SHANGHAI SSB300/30P #9375087 for sale

Manufacturer
SHANGHAI
Model
SSB300/30P
ID: 9375087
Vintage: 2018
Stepper 2018 vintage.
SHANGHAI SSB300/30P is a photoresist equipment designed to enable reliable fabrication of microelectronic devices with precise mask dimensions. It is the ideal choice for processes and applications which require high resolution and tight process control such as high-density substrates and intricate integrated circuit designs. The system combines two technologies, soft-baked, organic photoresist and e-beam lithography, for the precise transfer of pattern diagrams onto a substrate. The photoresist employed is a type of photo-sensitive material that undergoes a chemical reaction with exposure to light or energy. E-beam lithography is used to expose the photoresist to a beam of electrons that is projected onto the substrate in order to form a pattern. SHANGHAI SSB300/30P features an optical exposure head with adjustable lense for precise patterning on a substrate. The lense is adjustable for a range of focusing level and spot sizes. The photoresist on the substrate is then soft-baked at a controlled temperature to keep the surface free from defects before patterning. The exposure head is then adjusted to match the design requirements of the substrate and the pattern is projected onto the substrate. After the exposure process completes, a post-exposure bake operation follows to set the pattern into the photoresist. The post-exposure bake temperature and time are optimized to develop the pattern onto the substrate. The substrate is then washed or etched to render the developed pattern on the substrate. SHANGHAI SSB300/30P offers excellent resolution and accuracy with an advanced control unit that ensures a precise, repeatable process. It features an automated in-situ cleaning machine to ensure residue free substrates and easy maintenance to maximize uptime. The unit also offers a range of exposure times to meet the requirements of different substrates and mask patterns. SHANGHAI SSB300/30P is an ideal solution for microelectronic fabrication with its highly reliable processes and precise patterning capabilities. Its performance, flexibility and durability make it the top choice for complex and intricate device fabrication.
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