Used SIDRABE WD 200EM #293795312 for sale

SIDRABE WD 200EM
Manufacturer
SIDRABE
Model
WD 200EM
ID: 293795312
Vintage: 2011
PVD Coater High-intensity effusion source Plasma magnetron source Maximum run length: 300 to 400 mm Voltage: 3‑phase, 400 V (+6% / −10%) Frequency: 50 Hz (±2%) Control circuits voltage: 220 V AC, 24 V DC Hardness: < 5 °dH Conductivity: < 10 µS/cm pH level: 6 – 8 Filtration: < 75 µm Temperature range: 15 – 20 °C Pressure range: 2.5 – 3.0 bar Installed power: 40 kW Process pressure: 1×10⁻⁵ – 5×10⁻⁴ Torr Process: Evaporation of lithium, optional magnetron sputtering of metal oxides Process gases: Argon (Ar), Carbon dioxide (CO₂) 2011 vintage.
SIDRABE WD 200EM is a photoresist equipment that plays a crucial role in the microelectronics industry for the fabrication of integrated circuits, printed circuit boards, and other electronic components. This advanced photoresist system is designed to facilitate the intricate process of photolithography by offering high-resolution patterning capabilities and reliable performance characteristics. At the core of WD 200EM unit is its photoresist material, which is a key component in the photolithography process. Photoresists are light-sensitive materials that undergo chemical changes when exposed to light, making them ideal for transferring patterns from photomasks onto substrates. In the case of SIDRABE WD 200EM, the photoresist material is formulated to provide superior adhesion to various substrates, excellent resolution, and a wide process latitude. One of the standout features of WD 200EM photoresist machine is its high resolution capabilities. The tool is optimized to produce fine patterns with sub-micron feature sizes, allowing for the creation of intricate designs on semiconductor wafers and other electronic substrates. This high resolution is achieved through the precise control of the photoresist formulation and the exposure parameters during photolithography. In addition to its high resolution capabilities, SIDRABE WD 200EM asset offers excellent process stability and reliability. Consistency is essential in the semiconductor industry, where even the slightest variations in process parameters can lead to defects and yield losses. WD 200EM model is engineered to deliver consistent results batch after batch, ensuring uniformity in pattern transfer and reducing the risk of process deviations. Moreover, SIDRABE WD 200EM equipment is compatible with a wide range of exposure tools, including i-line, g-line, and broadband UV sources. This flexibility allows semiconductor manufacturers to choose the most suitable exposure system for their specific applications while still benefiting from the high performance of WD 200EM photoresist material. Another notable feature of SIDRABE WD 200EM unit is its excellent adhesion properties. The photoresist material forms a strong bond with the substrate surface, ensuring that the patterned features remain intact during subsequent processing steps such as etching and deposition. This adhesion strength is essential for maintaining pattern integrity and preventing delamination or feature distortion. In summary, WD 200EM is a state-of-the-art photoresist machine that offers high resolution, excellent process stability, and superior adhesion properties for the fabrication of advanced electronic devices. With its advanced formulation and performance characteristics, SIDRABE WD 200EM is a preferred choice for semiconductor manufacturers looking to achieve precise patterning and reliable process control in their production processes.
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