Used SOKUDO RF3 #79692 for sale

SOKUDO RF3 is a photoresist equipment that combines high precision processing with the ability to create complex shapes and patterns. It is used in the areas of semiconductor wafer manufacturing, photomasks, and LCD displays. A photoresist is a material that is selectively removed by light. Using this material, it is possible to create intricate patterns and shapes on a variety of substrates. SOKUDO RF 3 uses deep UV curing and non-contact exposure of the photoresist. It features a high precision, automated exposure process that can be adapted for a range of substrates including photomasks, LCD panels, and other substrates such as quartz or glass. The automatic exposure process is designed to provide a high degree of accuracy for the patterning process, thanks to its high resolution. RF3 also benefits from a vacuum atmosphere and a dual-sided photomask. The vacuum atmosphere helps to reduce dust and other contaminants, while the dual-sided photomask ensures that the photoresist pattern is maintained on both sides of the substrate. In addition, the system can also be used to easily modify and adjust the photoresist pattern, as required. In terms of accuracy and speed, RF 3 is unmatched, with far less failure rates than other systems. It also provides a high level of repeatability and uniformity with each production run, thanks to its state-of-the-art multi-axis camera alignment unit. SOKUDO RF3 also benefits from a number of features designed to increase the reliability and reduce downtime, including advanced residual area controlling, automatic process monitoring, and an integrated mask verification machine. This makes it ideal for high availability processes such as those required for LCD manufacture. SOKUDO RF 3 has been designed to meet the needs of a wide range of customers, from small volume prototyping to large scale production. The tool provides exceptional performance and reliability, and is capable of meeting the most demanding requirements, from both high throughput and low volume prototyping to high accuracy, high complexity patterning.