Used SSC BPE-2708-SP #9194177 for sale

SSC BPE-2708-SP is a photoresist equipment designed for use in semiconductor production and advanced multilayer packaging. It is a patented low temperature bakeable photoresist that offers superior resolution, higher film thickness, and improved profile control. The system is composed of two parts: a photoresist unit and a developer machine. The photoresist tool consists of two components: a photosensitive emulsion and an acid catalyzed silicon polymer. The photosensitive emulsion contains an organic diazonium compound, a catalyst, and an ultraviolet absorber. The acid catalyzed silicon polymer contains a mixture of silicon, organic, and inorganic acids. These components react when exposed to light to form a stable cross-linked polymer network. After exposure to light, the photoresist is processed using an alkaline developer. The developer asset consists of a surfactant, an oxidizing agent, and an alkali-metal hydroxide solution. The surfactant aids in the removal of the exposed areas of the photoresist film while the oxidizing agent helps to increase the solubility of the exposed areas. The alkali-metal hydroxide solution helps to neutralize the acid in the photoresist to enhance the adhesion of the photoresist to the underlying substrate. Once the developer model is complete, the photoresist is activated by a bake process. The bake process helps to toughen the film and improves adhesion. It also helps to reduce pinholes while increasing resolution and film thickness. The final film layer that results from BPE-2708-SP equipment is highly resistant to thermal and mechanical stresses. This superior performance is due to its low thermal expansion and low shrinkage rate. It is also highly resistant to chemical attack and has excellent wetting properties. The film layer is also capable of withstanding temperature doses up to 500°C. Overall, SSC BPE-2708-SP photoresist system provides superior photolithography performance for the production of semiconductor devices and other multilayer packaging applications.