Used SVG 16233 #9397148 for sale

SVG 16233 is a photoresist equipment manufactured and sold by Specialty Verification Group (SVG). It is a two-component, water-based photoresist system designed for use in semiconductor and microelectronic applications. The unit provides a method for forming thin and uniform polymer barriers over wafers. 16233 is composed of two components: a sensitizer and a resist. The sensitizer is a solution of organic compounds that are designed to be adsorbed onto the surface of a substrate, such as a silicon wafer. After sensitizer application, the substrate is exposed to a light source, typically ultraviolet light. The light causes a chemical reaction to occur and the sensitizer is converted to a polymeric structure that is insoluble in standard solvents. This polymeric structure is referred to as the resist. The resist formed by SVG 16233 photoresist machine is a thin and uniform barrier over the wafer. The thin layer of resist can be used to protect the doped layers of the wafer from chemical etching. The resist also serves as a mask during fabrication processes while providing better topographical control over patterned circuits. The barrier formed by the resist is also able to prevent secondary oxidation that occurs when photoresist systems with thicker layers are used. 16233 is designed to be easy to use in photoresist applications. The two components are compatible with standard micromasking techniques, and the tool can be applied by automated spin-coating. Additionally, the asset provides good adhesion between the resist and the substrate, which allows for reliable lift-off of masks and circuits. The model is also stable under high temperatures and is chemically resistant to subsequent processing steps. SVG 16233 is a straightforward photoresist equipment that is suitable for use in various semiconductor and nanofabrication processes. The system is composed of two components, which are easy to apply and provide a consistent carbon-based resist. The thin resist layer can provide good adhesion and topographical control during fabrication processes, while also protecting wafers from oxidation and etching.