Used SVG 88-3 #117933 for sale

Name: SVG 88-3
Brand: SVG
SKU: 117933
Availability: InStock

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Photoresist

Manufacturer

SVG

Model

88-3

ID: 117933

Wafer Size: 3"

single cabinet coater and developer system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive Track 2: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive Track 3: send, bake, chill, MD develop, back, chill with flood expose, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: Polyurethane Silicone Viton Automated transfer arm Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 108 x 54 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.

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SVG 88-3 is a photoresist equipment developed by Sun Chemical, which is suitable for use in semiconductor and sensor technology applications. The system is made up of three components; a carrier, a photoresist and an aqueous developer. The carrier is a pre-sensitized sheet which enables the photoresist to adhere to the surface of the substrate. This is then exposed to lithographic light sources in order to expose the portions of the photoresist that need to be etched. The photoresist is a light-sensitive material which is applied to the substrate prior to exposure. When exposed to light, it develops a reduction in its solubility, allowing it to selectively cover the exposed parts of the substrate, thus creating patterns. The light source used to expose the photoresist is typically a mask, which has openings of various sizes and shapes determined by the pattern being etched. The developer is an aqueous solution which is used to dissolve away the unexposed photoresist, revealing the underlying substrate surface. The intensity and duration of the developer must be accurately balanced to ensure that all of the unwanted residues and tissue debris are washed away, while leaving only the desired pattern. 88-3 unit is made up of a wide variety of carrier and photoresist types which are designed to meet the needs of different applications. The two main components of the photoresist are the photosensitive polymers and the radiation absorbing dyes. The polymers are used to make sure that the photoresist has the right amount of solubility and adhesion for the specific application. While the dyes are used to optimize the light absorption and response to the lithographic light source. SVG 88-3 machine is extremely versatile and robust, allowing it to be used in a wide range of semiconductor and sensor manufacturing applications. The ability of the tool to accurately define patterns of different sizes and shapes makes it particularly useful for creating intricate designs with fine details. It is also capable of providing high throughput and resolution, making it an ideal choice for large-scale production. With the ability to cover large areas with a single sheet, 88-3 has become an essential tool for the production of integrated circuits, sensors and other types of electronics.