Used SVG 88 Series #9033562 for sale

Track system, 6" Wafer: 6" glass Wafer dual Track, 6" Wafer flow: Left to Right Transport wafer: ATS arm Software have 99 process program capability with up to 9 event per program Can "link" two or more programs together to create longer programs Intergrades components exercise for system maintenance Real time displaying motor speed Capable to save or re-stored recipe and option data into CPU flash when CPU need repair Auto calibration HPO wafer carrier motor Full "2-way" diagnostics Full range of programmable options All modules grounded to Copper bar ground 1” X ¼” X 80”, “Copper bar ground” grounded to facility ground discharge static, clean signal Coater Process: Moving/pivoting arm dispense with (3) dispense capability Developer process: Moving dispense arm with 2 sprays, 2 stream nozzle, Air ring, top rinse and back side rinse Track 1: Send-Vapor Prime-Chill-Coat-bake-Chill-Receive Track 2: Send-Bake-Chill-Develop-Bake-Chill-Receive Track 3: Send-Send - Coat-Bake - Receive-Receive Track 4: Send-Send - Coat-Bake - Receive-Receive Indexer Assembly: Banner wafer sensor or Capacitive sensor Grey Teflon coat platform 3/16" or 1/4" pitch (for 25 or 20 wafer cassettes) Coater Assembly: Moving/pivoting dispense assembly with 3 dispense capability Peek material wafer chuck Top EBR Bottom EBR Top, bottom EBR, catch cup rinse, tub fill (fill Pre-dispense cup by option select timing to prevent dispense nozzle dry off at home position, idle mode) Upgraded Centering unit with dual cylinder shaft Digital pressure (vacuum) switch Sub-micron servo motor using brushless motor with Pacific Scientific controller max 6500 RPM +/-1 RPM no need calibration Flat finder, wafer run smooth at high speed Upgraded Stepper motor up/down 3 position Assy. for Spindle replace 3 position cylinder more stable, reliable 1 upgrade Cybor pump /each track 1 five gallon canister for EBR 1 five gallon canister for CCR 1 three gallon canister for Tub fill CKD valve replacement for high cost, obsolete valve for Spindle valve assembly Catch cup Assembly is easily removable, cleanable, also catch cup have the catch cup rinse assembly, clean itself by option select to set catch cup wash wafer count, catch cup wash time interval Tub fill pre-dispense cup by option select fill solvent to the cup by timing prevent nozzle dry off when track at idle position, option select purge the dispense nozzle clean the tip itself before process, amount is equal amount to real process High purity Teflon tubing for fluid line, dispense line High level sensor for coater drain jar work with software Low level sensor for Photo Resist bottle work with software Low level sensor for EBR canister work with software Developer Assembly: Moving dispense arm Assembly with 2 spray, 2 stream nozzle Peek material wafer chuck Sub-micron servo motor using brushless motor with Pacific Scientific controller Max 6500RPM +/-1RPM no need calibration Top rinse and backside rinse and air ring Three way Teflon valve for DI water return for top rinse prevent particle build up Digital vacuum switch Upgraded Stepper motor up/down 3 position Assy. for Spindle replace 3 position cylinder Flat finder, wafer run smooth at high speed Cooling jacket for Developer fluid line, CKD valve replacement for high cost, obsolete valve for Spindle valve assembly Vapor Prime Assembly: Stainless steel exhaust Contact or proximity control bake with lid up Vacuum or HMDS bake with lid down All Teflon dispense lines Pressure canister for HMDS Hard clear anodized lid Digital pressure (vacuum switch) Cast-in heat element 450 W Capable of operating at temperature ranging from 50 degree C to 400 degree C in dehydration bake cycle and to 200 degree C in vapor prime cycle RTD temperature probe with 0.1 degree C increment readout Remote digital temperature controller Watlow EZ zone controller Dual digital LED display Auto tuning, +/-0.1% calibration accuracy PID control-no drift or shifting Temperature uniformity under +/- 2 degree C Hot Plate Oven Assembly: Stainless steel exhaust Hard clear anodized HPO block Three pin wafer lift assembly HPO block with side-mounted vacuum port-guaranteed no leak Contact or proximity control bake Cast-in heater elements 450W Watlow EZ zone Temperature controller Dual digital LED display Auto tuning, ±0.1% calibration accuracy PID control – no drift or shifting Temperature uniformity under ±2°C RTD temperature probe with 0.1°C increment readout HPO temperature range from 50°C to 400°C Digital pressure (vacuum) switch Remote digital temperature controller Chill Plate Assembly: Hard clear anodized chill plate Three pin wafer lift assembly Digital pressure (vacuum) switch Power: 208VAC, 3 phase, 60Hz.