Used SVG 88 #9105742 for sale

SVG 88 is a positive photoresist equipment specifically formulated for superior performance on a wide variety of substrates. The positive photoresist process allows operators to achieve high-quality printing on a variety of surfaces, from low-temperature ceramics to soluble polymers films. 88 is an easy to use, highly versatile photoresist system that is used in the semiconductor industry to produce quality chip products. SVG 88 is a positive photoresist unit that consists of a photoactive compound (PAC) and a solubilizer. The PAC is a photoreactive material that is activated by UV light. It typically consists of an acrylic polymer, an acid, and a photoinitiator. The photoinitiator initiates a light-induced free radical reaction that initiates the reaction of the PAC with the acid. The acid then serves to break the polymer down into reactive species which can be removed by the solubilizer. The solubilizer is used to dissolve the regionalized PAC away from the areas that are not exposed to the UV light. These areas remain intact on the chip and thus form the final image. The solubilizer used in 88 typically contains a thixotropic-enhancing solution that helps suspend the PAC within the solubilizer for more efficient dissolution. The most important benefit of using SVG 88 is that it produces low-resolutions features with superior uniformity and resolution. This makes it an ideal choice for chip design and fabrication. It also works incredibly well for chip repair and rework. 88 is also highly compressible and elastic, making it easy to use and very reliable. Moreover, SVG 88 offers excellent resolution and throughput. It can be used on a variety of substrates ranging from plastic films to metals such as aluminum and copper. The machine also produces very low edge defects and low resistivity. It's also heat resistant and can be heated up to 225°C. Overall, 88 is a positive photoresist tool designed for superior performance on a wide variety of substrates. It offers excellent resolution and throughput, coupled with low edge-defects and low resistivity. It's heat resistant, making it ideal for chip production and repair. It's also highly compressible and elastic, making it easy to use and highly reliable.