Used SVG / ASML 90S #9245069 for sale

SVG / ASML 90S Photoresist Equipment is a lithography tool used in the fabrication of semiconductor chips. As such, it is a key component in the semiconductor industry's ability to produce ever-shrinking and increasingly powerful chips with complex features. The system combines electron-beam resist processing, advanced imaging optics, wafer alignment technology, and advanced wafer handling systems to create the best chip geometry and topography possible. SVG 90S is comprised of two components: the Optics Module and the Support Module. The Optics Module is equipped with a Charged-Particle (electron) column, feature imaging optics, a low-vacuum resist exposure environment, and a trigger unit that is used to control electron-beam exposure. The Optics Module can be programmed to produce very precise features in resist layers during the exposure process, compensating for any distortion due to the wafer topography or printing errors. The Support Module serves to provide automated wafer alignment, substrate handling, and cassette loading. The entire machine operates by first spinning the wafer until it is at the correct speed, then the electron-beam column begins to shoot electrons down onto the resist layer of the wafer. The electrons are deflected and focused onto the desired features of the chip design through the imaging optics. The accuracy and precision of the exposure is controlled by the trigger tool of the Optics Module, which is designed to time and guide the electron beam in a very precise manner. After the feature exposure is complete, the asset is programmed to move the wafer to the Support Module for alignment, cassette loading, and substrate handling. The combination of the electron-beam resist processing of the Optics Module and the automated handling of the Support Module of ASML 90S offers excellent accuracy and repeatability, allowing it to precisely generate and accurately reproduce desired features on wafers. This model is therefore extremely valuable in the fabrication of advanced semiconductor chips, enabling manufacturers to create ever more powerful, efficient, and small chips.