Used SVG / C&D SEMI 86 Series #293655065 for sale

SVG / C&D SEMI 86 Series Photoresist Equipment consists of several elements which come together to enable the transfer of fine patterns onto various substrates. It utilizes a special high-resolution photomask scanner to produce a precise image on the chip wafer, and the resulting image is then transferred onto the substrate via an exposed chemical process. The photomask is also used to erase or erase back the patterns to enable repatterning of the chip wafer. The photomask scanner with a 15nm resolution and 4096x2096 pixel aspect ratio can accurately scan chips with greater precision than traditional camera-based systems. The photomask scanner can also accurately scan narrow pitches, allowing for more intricate designs to be put onto chips. In addition to the photomask scanner, SVG 86 Series Photoresist System also includes a coolant unit which helps maintain the optimal temperature for both the photomask and wafer during operation. This keeps any damage caused by thermal expansion to a minimum, ensuring that the patterns will be accurately transferred onto the substrate. Furthermore, the machine also uses a proprietary liquid resists, providing a higher quality and longer lasting photoresist than traditional photoresists. The photomask produced by C&D SEMI 86 Series Photoresist Tool is compact and lightweight, making it easy to move and store. It features both uniform wetting of the photomask and excellent adhesion of the photoresist, providing excellent quality and reproducibility of the pattern transferred to the substrate. With its compatibility with both mini and standard photomask sizes, the asset can easily accommodate the requirements and constraints of different chip designs. Overall, 86 Series Photoresist Model is an advanced photoresist equipment that enables the accurate, high-quality transfer of fine patterns onto substrates. With its robust design, high-resolution photomask scanner, and liquid resists, the system offers excellent precision, reliability, and cost-effectiveness for chip production and development.