Used TEL / TOKYO ELECTRON ACT 12 #9239543 for sale

TEL / TOKYO ELECTRON ACT 12 is a photoresist equipment developed by TEL Limited (TOKYO ELECTRON) for use in the semiconductor industry. The system is designed to provide accurate, even, and repeatable results in processing photoresist coatings on semiconductor wafers. TEL ACT 12 unit is designed with an automated cleaning arm that removes any contamination from wafers prior to the photoresist coating. The wafers are then placed in the machine, where precise amounts of photoresist are applied in layers up to a total of 12 microns in thickness. The layering of the photoresist is accomplished through the use of a laser-based interferometric stage that ensures accurate thickness control and uniformity of the coating. The automated cleaning arm also ensures that any excess photoresist is removed from the wafer prior to the post baking process. Post baking is done at high temperatures (up to 500 degrees Celsius) in order to ensure sure that the photoresist coating is fully cured and ready for processing. TOKYO ELECTRON ACT12 tool is equipped with an advanced monitoring asset that enables it to accurately control and monitor the temperature of the model during processing. This ensures that the photoresist layer is accurately cured and that the temperature during the process does not exceed the recommended limits. The software interface of ACT12 is user friendly and intuitive. It offers various programming options, as well as an intuitive user interface for controlling the operation of the equipment. This enables users to easily set up and adjust the photoresist layer as needed. The system also offers advanced automation capabilities, including automatic wafer handling and calibration. This enables the user to quickly and easily adjust the layers and thickness of the photoresist. TOKYO ELECTRON ACT 12 photoresist unit is a powerful, precise, and reliable machine for processing and coating semiconductor wafers. Its advanced features enable users to quickly and easily achieve uniform and repeatable coatings on wafers, while its automated cleaning arm ensures that no contaminants are left on the wafer prior to processing. The advanced monitoring tool ensures that the temperature of the asset is maintained in a controlled manner, enabling the user to precisely control the photoresist layer during processing. It also offers an intuitive user interface that allows users to easily program the layers and thickness levels.