Used TEL / TOKYO ELECTRON ACT 12 #9281479 for sale

TEL / TOKYO ELECTRON ACT 12 is a photoresist equipment used in semiconductor substrate processing. It is capable of performing a wide variety of processes, including sputtering, ion implantation, wafer cleaning, etching, and more. The system uses a light-activated chemical reaction to shape the surface of the wafer. It is designed to enable production of highly precise thin film devices with a high density of features. TEL ACT 12 unit combines the advantages of photolithography and plasma etching. Photolithography is a technique for patterning the surface of a material by exposing it to a source of radiation. The radiation causes chemical changes to the exposed area, allowing the fabrication of fine patterns. Plasma etching is a process in which a plasma environment is used to etch the surface of the target material. The combination of these two processes enables TOKYO ELECTRON ACT12 to create intricate nanometer-scale features with high precision and accuracy. The photoresist layer of ACT 12 is applied to the surface of the wafer and exposed to a mask that contains the desired pattern. Once the mask is removed, a separate light source (usually UV or E-beam) is used for the direct imaging of the pattern. A special coating is then used to protect the photoresist layer and allow for controlled etching of the wafer. Next, the machine is heated to a high temperature to activate the chemical reaction of the exposed photoresist layer. The patterning reaction results in a thin film of photoresist that is left on the wafer. The remaining photoresist can then be removed with an appropriate solvent. Finally, the tool can be used for any of the processes mentioned earlier, such as sputtering or ion implantation, to create the desired pattern or device. The entire process is controlled with the software asset provided by TOKYO ELECTRON ACT 12, which ensures quality control throughout the entire process. In conclusion, TEL ACT12 is an advanced photoresist model that can create highly precise and intricate nanometer-scale features. Its combination of photolithography and plasma etching enable the production of sensitive devices for a range of applications. The software equipment provided by the system allows for complete control of the process and ensures quality control throughout.