Used TEL / TOKYO ELECTRON Clean Track ACT 12 #9284887 for sale

TEL / TOKYO ELECTRON Clean Track ACT 12 is a photoresist equipment used for etching and lithography processes in production of integrated circuits. The system uses a built-in temperature-controlled oven and a chamber that is consistently maintained at a low pressure. The design has an automated wafer transfer unit for transporting wafers between processes in a factory environment. The machine also contains an integrated high-precision laser alignment tool for determining the exact position of the wafer. TEL Clean Track ACT 12 has a full suite of capabilities and features for advanced pre-treating of wafers with photoresists. It is equipped with an advanced spin-shower liquid for photoresist application, which can be set to spin at variable speeds. The asset also has an integrated exposure model which precisely applies UV energy to defined areas of the wafer using a mercury-free excimer laser. The metal halide lamp can also be used for exposure of photoresists if desired. The precision-controlled dry and wet etching capabilities in TOKYO ELECTRON Clean Track ACT 12 feature a combined plasma ashing/stripping station for both dry and wet etch processes. The software-controlled equipment has the capability to adjust the etch rate, allowing greater control of etching features in microelectronic production. The post-applied chemical material and post-etching treatments are monitored and managed through an embedded computer-controlled system. Clean Track ACT 12 unit has comprehensive particulate and chemical waste handling capabilities. The machine is designed to control particle emissions to less than 0.1 micron, and is certified for usage with no risky substances. This means that the tool is equipped with advanced filter systems to control emission of particles, allowing the users to operate in clean environment. In summary, TEL / TOKYO ELECTRON Clean Track ACT 12 photoresist asset is a compact and high performance production model that offers innovative features such as precise pre-treating and etching capabilities, advanced particle and chemical waste management, and an integrated monitoring equipment for safer operation.