Used TEL / TOKYO ELECTRON Clean Track ACT 8 #9198617 for sale

TEL / TOKYO ELECTRON Clean Track ACT 8
ID: 9198617
Wafer Size: 8"
(3) Coater / (4) Developer system, 8" Left to right wafer flow (4) UNCs DUV Open cassette Interface for CANON ES3 Dual block.
TEL / TOKYO ELECTRON Clean Track ACT 8 is a photoresist equipment designed for deposition processes that require increased precision, resolution, and cleanliness. It is designed with advanced features and technologies for lithography processes and is optimized for processes where high temperatures and/or high resist physics are involved. It is capable of delivering improved controllability and accuracy for deposition features with minimal physical contact. TEL Clean Track ACT 8 uses advanced photoresist technology to enable precise atom layer deposition during processes for specific cycles. This technology provides accurate control of features with minimal physical contact, which allows for efficient lithography process production. The system includes Plasma Enhanced Chemical Vapor Deposition (PECVD), Multi-stage Ashing (MSA), and LPCVD (Low Pressure Chemical Vapor Deposition) technologies to enable precise atom layer deposition. The unit also includes high resist physics technology for lithography processes that require high temperatures. TOKYO ELECTRON Clean Track ACT 8 is designed with a unique chamber structure and integrated robot arms to ensure optimal results with minimal physical contact. This technology also enables accurate masks with higher resolution than traditional photolithography processes. The integrated robot arms are designed for greater flexibility and precise control of the deposition processes. Clean Track ACT 8 is capable of handling a variety of substrates, including common stainless steel, aluminum, and quartz materials. The machine is also capable of coating and wafering thin and thick films at low temperature. Additionally, the tool is capable of operating in both batch and continuous processes. TEL / TOKYO ELECTRON Clean Track ACT 8 produces high-quality deposition results with minimal waste and minimal physical contact. With its advanced features and technologies, it is capable of producing precise masks with higher resolution than traditional photolithography processes. It is an ideal asset for deposition processes that require increased precision, resolution, and cleanliness.
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