Used TEL / TOKYO ELECTRON Clean Track Mark 8 #9269254 for sale

TEL / TOKYO ELECTRON Clean Track Mark 8 is an advanced photoresist equipment designed for wet chemistry processes. It is composed of two main components, the RobotCVision ultra-high accuracy machine vision system and the advanced Vacuum Pressure Chemical Vapor Deposition (VPCVD) process technology. The RobotCVision employs an ultra-high accuracy and fast scanning technology, making it capable of precisely controlling the photoresist pattern sizes, alignments and spacing. The VPCVD process on the other hand is utilized for the deposition of the thin film on the surface of the wafer during the etching process. Together, the two components provide gentle handling and minimal contamination resulting in a highly accurate and uniform surface finish on wafers. TEL Clean Track Mark 8 is preprogrammable and allows for auto-tuning which optimizes both the deposition and etching speeds, ensuring consistent high-quality results while minimizing unit downtime. It also incorporates thermal management technologies and allows for free-form profile adjustment. The wafers are exposed to the thin film and photoresists are applied in a controlled, uniform manner so as to ensure accuracy. The machine also comes with dual bake plate functions which facilitate a focus on pre- and post-process operations. TOKYO ELECTRON Clean Track Mark 8 tool is a reliable and robust solution for photoresist processing. It provides users with a comprehensive solution for wafer processing and offers superior process uniformity across all wafers, even at the highest aspect ratios. The asset is also a cost-effective choice for wafer etching and thin film deposition, ensuring repeatable and reliable photoresist process results. Both the RobotCVision and VPCVD technologies offer multi-level process control to ensure consistent, acceptable performance from the model. Furthermore, the advanced control algorithm of Clean Track Mark 8 equipment enables a fast, smooth recipe transition resulting in process robustness.