Used TEL / TOKYO ELECTRON CS450 #9269610 for sale

TEL / TOKYO ELECTRON CS450 photoresist process is an advanced and robust system used in the manufacture of integrated circuits. At its core is a 3-stage deposition - spin coat, immersion, and post exposure bake (PEB) - which is used to deposit photopolymer films on a semiconductor substrate. This film is then used to transfer circuit patterns onto said substrate. TEL CS450 is an economical spin coater which excels in providing uniform and precisely controllable spin coat thicknesses, enabling reliable preservation of the pattern layout. It is also designed to ensure that the optimal parameters are set for each material type and job. This is done via the utilization of pre-defined recipe files which can be tailored to any specific variable, like nozzle size, stage temperature, and spin speed. The core technology behind TOKYO ELECTRON CS 450 is its immersion process. The photoresist film is precisely deposited onto the substrate using a controlled vacuum, which allows for full surface coverage and consistent quality. TEL CS 450 utilizes a special chemical solvent designed to evaporate quickly, leaving behind a uniform layer of photoresist on the surface of the substrate. While the immersion step can be omitted if desired, its use will ensure that the photoresist pattern will be transferred onto the substrate without leaving any defects or damage. The last stage of TOKYO ELECTRON CS450 photoresist process is the post exposure bake (PEB). This is a crucial step in photoresist processing as it controls the post-exposure physical, chemical and morphological properties of the film. The PEB temperature and relative humidity factors which are set during this process are optimized to ensure the photoresist film is properly and fully exposed, and that it will remain stable and reliable over extended operating times. Overall, TEL / TOKYO ELECTRON CS 450 photoresist process is a highly reliable and economical system which is proven to produce circuits with consistent quality and high yields. Its integrated 3-stage deposition process ensures fully controllable spin coat thicknesses, providing reliable preservation of pattern layout. This combination of precision and robustness makes CS 450 an ideal choice for any semiconductor fabrication application.