Used TEL / TOKYO ELECTRON CS500 #9269718 for sale

TEL / TOKYO ELECTRON CS500
ID: 9269718
System HITACHI LE-4000A Spare parts Table.
TEL / TOKYO ELECTRON CS500 is a photoresist equipment designed for advanced semiconductor and microelectronic device manufacturing. It is capable of etching and stripping photoresist layers from various substrates, including silicon wafers, quartz wafers, OLED substrates, and several metals. The advanced patterning capability of TEL CS500 maximizes photoresist utilization, making the process faster and more cost efficient. TOKYO ELECTRON CS 500 features a high-resolution imaging system that is capable of imaging features as small as 0.35 micrometers, providing accurate repeatability for circuit features. The optical unit also has a low refractive index, meaning that it can reduce diffraction and enable transmission of higher energy radiation. This gives the machine higher resolution and higher throughput, leading to faster and more accurate etching of circuits. CS 500 is equipped with a highly efficient post-electron multiplier detector, which can maximize the signal-to-noise ratio of the photoresist. It also has a high sensitivity broadband CO2 laser delivery tool, which enables low voltage operation and significantly reduces sputtering under high-energy radiation. The delivery asset also features a flat-field energy detector, which allows for accurate processing across large areas. TEL CS 500 also features a special chamber design, which helps to reduce contact time for etch processes while maintaining a low temperature environment. This allows for reduced processing times and improved film stability. CS500 also includes a unique split chamber configuration which will reduce contamination levels by preventing cross-contamination between the wafer and the chamber. Finally, TOKYO ELECTRON CS500 includes an advanced control program that allows for quick setup and easy operation. The control program is designed to allow users to adjust processing parameters on the fly, ensuring that the process is optimized for the substrates being processed. It also allows for remote control of the shell temperature and chamber pressure for the ultimate in etching precision.
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