Used TEL / TOKYO ELECTRON Mark 7 #9250083 for sale
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ID: 9250083
Wafer Size: 6"
Vintage: 1993
Coater / (2) Developer system, 6"
1993 vintage.
TEL / TOKYO ELECTRON Mark 7 is a highly advanced and versatile photolithography equipment, commonly used in semiconductor fabrication. It is capable of producing intricate layers of metal, polymers, and/or crystalline materials, in order to build electronic components and other complex micro-devices. The system consists of a series of components contained within a large, environmental chamber, which is housed in a cleanroom facility. The process begins with a thin layer of photoresist material which is applied to the device substrate. The substrate is then exposed to extreme ultraviolet (EUV) light pulses, which triggers a reaction within the photoresist. As it is exposed, chemical bonds form between the molecules, forming shapes unique to the patterns in the EUV beam. This chemical reaction causes the photoresist to harden, providing a mask for the next step in the process. The hardening photoresist is then exposed to a chemical etch which removes any of the exposed portions of the substrate. The etch chemicals are either gaseous or liquid and are deposited on the substrate. The etching process is repeated over the entire substrate until the desired shapes have been etched into the material. This chemical etch is highly precise and can be monitored and regulated with high accuracy. Notably, the etch processes allows for the formation of complex and exact circuit lines, essential for intricate micro-devices. Next, the remaining photoresist is removed with a plasma asher, so that another deposition of material may be applied. The materials used in this stage are usually polymers, which can be applied with great precision thanks to their advanced process control features. The unit also allows for material selection optimization, allowing for the optimization of electronic properties of the materials, such as conductivity. The final step of TEL MARK7 process is the deposition of a metal layer, such as aluminum or copper. The metal deposition process is similar to the polymer deposition process but involves using a special vacuum tool, known as a sputter deposition machine. This tool is designed to provide an efficient vacuum process for metal deposition on the substrate. Notably, the sputter deposition tool can be highly customized and controlled, allowing for the development of complex metal contacts that are used for interconnects. Unlike the other processes, TOKYO ELECTRON MARK-7 is capable of processing multiple layers of metal, allowing for the formation of deeper interconnects or for the construction of multilayer structures. MARK7 is an excellent asset for the production of intricate electronics and micro-devices. It combines several techniques, such as photolithography, polymer deposition and metal deposition, into one seamless process. This close control over the entire process ensures that the systems output is of a very high quality, allowing for the construction of complex devices with exact dimensions.
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