Used TEL / TOKYO ELECTRON Mark 8 #9351474 for sale

TEL / TOKYO ELECTRON Mark 8 is a state-of-the-art photoresist equipment designed to fabricate thin wafer devices at the sub-micron level. This system features advanced and precise imaging optics which generate a focused and clear image of a device, enabling consistent, accurate, clean photolithography alignment. Furthermore, TEL MARK8's Sub-One Wavelength Method is capable of producing complicated patterns in a wide range of devices in the sub-micron range. TOKYO ELECTRON MARK-8 has three main components: a source input, an optical projection unit, and a resist coating mechanism. The source input is compatible with a variety of laser sources, allowing for a range of computationally generated exposure profiles. The optical projection machine is the heart of the tool, and consists of a UV light source, a programmable optical scanner, and an imaging objective. By controlling the timing and direction of the UV beam, this asset can generate highly accurate images at sub-micron feature sizes. The model's resist coating mechanism dispenses photoresist onto the wafer at extremely precise levels. Thanks to this accuracy, the resist layer is consistent and uniform throughout the device. TOKYO ELECTRON MARK8 also features several advanced technological features. For example, the laser scanning and exposure equipment is capable of real-time exposure scanning, which is ideal for thin-film devices. It can be used for simultaneous lithography and exposure operations, resulting in higher throughput. Additionally, this system can analyze surface defects and edge damage quickly and accurately in order to reduce post-processing costs by preemptively removing any damaged regions. In summary, TEL Mark 8 is a highly advanced photoresist unit capable of producing precise devices with precision laser scanning. Through the programmable imaging optics, the Sub-One Wavelength Method, and additional features such as real-time exposure scanning, this photoresist machine is capable of multi-functional lithography alignment and resistant coating operations with high-accuracy and throughput.