Used VERTEQ MCS-2600-3A-UCX #9196057 for sale
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VERTEQ MCS-2600-3A-UCX photoresist equipment is a state-of-the-art production tool designed for advanced photolithography applications. It utilizes a patented, acoustic-coupled heat sink technology to evenly distribute heat across the surface of the photoresist. By maintaining a uniform temperature field over the entire photoresist layer, the system is able to produce highly precise lithography patterns with improved detail and accuracy. MCS-2600-3A-UCX features a dual-compartment unit, with one chamber housing the acoustic heat sink and the other filled with di-methyal-cyanide (DMAC)-based photoresist. The two components are coupled by an acoustic transducer, which transmits the heat generated by the heat sink into the photoresist. Both chambers are individually temperature-controlled to ensure a consistent resist temperature over extended runs. VERTEQ MCS-2600-3A-UCX is capable of producing well defined lithography etch patterns with critical dimensions as small as 0.4 microns. The machine incorporates a number of process automation features, such as a fully automated exposure chamber with auto-loading/unloading capability and comprehensive user monitoring and control capability. It is suitable for a range of applications, including semiconductor fabrication, pattern generation of LEDs and optical components and liquid crystal display production. In addition to providing excellent performance and reliability, MCS-2600-3A-UCX is designed to be a cost-effective solution for advanced photolithography applications. The tool offers maximum asset uptime and low maintenance costs due to the robust design of the components. The model is also capable of producing lithography templates at high speeds with high-resolution imaging. VERTEQ MCS-2600-3A-UCX is an advanced photoresist equipment designed to provide optimum performance, repeatability and reliability for the most complex photolithography processes. It utilizes a patented acoustic-coupled heat sink technology to maintain a uniform resist temperature and is capable of producing well defined lithography etch patterns with critical dimensions as small as 0.4 microns. The system offers robust performance and cost-effectiveness, making it an ideal solution for advanced photolithography applications.
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