Used KLA / TENCOR 9233398-NG #9236041 for sale

KLA / TENCOR 9233398-NG is a prober designed to help in the testing and analysis of semiconductor products. This high-performance prober has an automatic wafer placement system and provides an impressive array of features including high throughput, fast swap time, non-contact recording, and low-noise test solution. KLA 9233398-NG is designed to inspect a wide variety of applications including wafer-level, package-level, die-level, module-level, assembly-level, and special tests. It does this by providing a range of test capabilities such as surface non-contact recording, testing at multiple positions from a single prober, wafer and die contact testing, and advanced high-speed measurements. TENCOR 9233398-NG is a fully automated prober designed with high flexibility and scalability in mind. The wafer chucker will hold wafers up to 50 mm in diameter and is capable of handling die as small as 3 mm2. Additionally, the prober has a die transfer accuracy of better than ±7 μm, which allows for precise movement of the die during testing. Additionally, 9233398-NG prober has an H-tree test chip contact system that makes it suitable for both low-frequency and millimeter-wave applications up to 67 GHz. It also has a retrieval cycle time of 0.55 seconds, and a programmable non-contact test area of up to 53 mm in diameter. The prober also offers automatic recognition and tool mapping of wafer dies, as well as advanced measurements for signal integrity, measurement of DUTs, misalignment, and edge detection. In terms of accuracy, KLA / TENCOR 9233398-NG prober is designed to provide reliable repeatability and accuracy, resulting in improved test yields and better product performance. The prober is also designed to be robust and reliable, making it highly reliable for long-term usage. Given its advanced features and capabilities, KLA 9233398-NG prober is ideal for performing accurate, high-throughput testing and analysis of semiconductor products. It is especially suitable for applications such as wafer-level test, distributed packaging test, and high-frequency test.