Used AG ASSOCIATES 2146 #118008 for sale
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ID: 118008
Wafer Size: 3" - 6"
Vintage: 1987
Rapid thermal processing system, 3" - 6"
6 Gases(N2,O2)
AG pyrometer
Card cage with all boards
DC Power supply
MFCs
Power: 208 V, 50/60 Hz
No handler
1987 vintage.
AG ASSOCIATES 2146 is a rapid thermal processor (RTP) that has been designed specifically for semiconductor processing. 2146 has many features that make it ideal for modern semiconductor fabrication. AG ASSOCIATES 2146 has an incredibly fast process cycle time, allowing for higher throughput of silicon wafers. The system's cycle time can be reduced to 20 seconds, enabling up to 800 processes per hour. This allows for the installation of larger batches with shorter cycle times. 2146 allows for greater accuracy in the thermal profile during processing. It features precision laser diode temperature control in multiple zones, enabling extremely precise temperature control over individual zones or cascaded multiple zone thermal walls. This level of precision control can greatly reduce the variability of thermal cycle results, making the process more robust and uniform. AG ASSOCIATES 2146 also offers a wide range of process chemistries that can be used in the RTP process. For example, it is capable of providing oxidation, nitridation, annealing and etching. This allows it to meet the requirements of any given process, maximizing flexibility and efficiency. 2146 is also equipped with a precise temperature monitor, to provide optimal real-time control of temperatures over an actual process cycle. This monitor is used to ensure the thermal profile is accurate and reacts dynamically to changes in the process. Finally, AG ASSOCIATES 2146 offers a host of safety features such as gas control safety features and safety protocols for users. These features help to ensure that the process is being carried out safely and in compliance with the highest standards of safety. 2146 is an ideal system for manufacturers looking for an RTP process that is optimized for modern semiconductor processing. With its fast cycle times and precision temperature control, it can provide an efficient and robust solution for those looking to increase their production throughput and reduce their cost per wafer.
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