Used AG ASSOCIATES 410 #73198 for sale

ID: 73198
Wafer Size: 4"
Rapid Thermal Annealer, up to 4" wafers Manual controls Digital display Custom quartz holders available 400°C to 1200°C Max heat / cooling rate at 150°C/second.
AG ASSOCIATES 410 is a high-capacity rapid thermal processor (RTP) that is used for annealing and other high temperature processes. It utilizes two quartz quartz split-planar sintering furnaces to achieve rapid thermal processing. 410 model has a chamber of 10" x 6" x 4", with a temperature range of 20°C to 800°C. Allowing for no degradation of the sample material and with a uniform under-pressure distribution, AG ASSOCIATES 410 provides the perfect environment for the demanding needs of wafer-level processing. 410 features two independent thermal processing chambers, allowing for processes to run at different temperatures in both chambers at the same time. This enables processes with multiple temperature profiles and different time frames to be executed. The thermally programmable zone allows for temperature control to be fine-tuned, further contributing to the high-precision of the equipment. AG ASSOCIATES 410 is also equipped with a multi-gas control us, which adds to its versatility and ability to accommodate different process requirements that are achievable with different gas flow rates. 410 model also includes a heater, which acts as a heat source, and a transformer, which is capable of supplying high power to the heater. Additionally, AG ASSOCIATES 410 model is equipped with sensors that allow for accurate temperature control, eliminating the need for manual monitoring. 410 also has an embedded controller, allowing for both manual and automated operation of the system. Additionally, the user interface of the unit allows for multiple parameters to be set, including temperatures, gas flow rates, and thermal cycles. The built-in safety features of the machine also ensure that the processes executed are safe and efficient. AG ASSOCIATES 410 rapid thermal processor is a reliable and powerful tool that provides a high degree of precision for the demanding needs of wafer-level processing. With its independent thermal processing chambers and programmable zones, it is one of the best solutions for wafer-level processing. Additionally, its versatility, embedded controller and multi-gas control us makes it an ideal choice for a wide range of applications.
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