Used AG ASSOCIATES AW 610T #9272710 for sale
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ID: 9272710
Wafer Size: 6"
Vintage: 2012
Rapid Thermal Processors (RTP), 6"
With upgraded OS windows
Aluminum chamber
With water cooling and gold plating Isolated
Quartz tube without window oven control board
Main control board bottom and top heating: 21 (1.2 kW Each)
Radiation heating lamp modules
(4) Bank zones: Top, front, rear, bottom
Quartz tray, 3"-6" round wafer
Gas line
MFC Without shut-off valve
Holder: 100-800°C
NESLAB RTE7 Chiller
LCD Monitor, 17"
Mouse
Standard keyboard
T-Shape quartz with TC
Power supply: 208 V, 60 Hz, 50 A, 3 Phase
2012 vintage.
AG ASSOCIATES AW 610T Rapid Thermal Processor is designed to meet the requirements for rapid ramp rates and high temperatures required for advanced thermal processes in the semiconductor industry. AW 610T offers outstanding performance for a variety of fabrication processes including die bonding, die attach, diffusion, oxidation, reflow, metallization, and annealing. AG ASSOCIATES AW 610T is equipped with a dual-mode controller, enabling the user to program either a process profile or a steady-state temperature. This feature greatly enhances the user's flexibility in the determination of the oven setpoints. AW 610T features an effective top heat optimization algorithm which is designed to exploit distributed heating elements and effective temperature sensing for superb uniformity and control. AG ASSOCIATES AW 610T also includes a sophisticated wafer tracking program for both external and internal recipes. This functionality allows the oven to adjust the process parameters to accommodate varying conditions on individual wafers. AW 610T is equipped with an advanced self-test and auto-tune system that automatically initiates and completes safety tests of all components. This system helps to ensure a safe and reliable manufacturing environment. AG ASSOCIATES AW 610T also includes a multiple-zone mode operation to enable precise temperature control and optimized profile execution. Additionally, AW 610T is equipped with a modular design, making it easier to assemble, configure, and maintain, and allows for maximum flexibility in the operating environment. AG ASSOCIATES AW 610T has a maximum temperature range of 1000°C (1832°F) and a maximum ramp rate of 1°C/Sec (1.8°F/Sec). AW 610T is compliant with SEMI Standard 276, and is a cost effective solution for manufacturers who need to rapidly heat and cool wafers without sacrificing precision or temperature uniformity. Its reliable design and robust performance make it the ideal choice for many advanced thermal processes in the semiconductor industry.
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